Redundant Touch System

ABSTRACT

A touch sensor system includes touch sensors, drive-sense circuits (DSCs), memory, and a processing module. A DSC drives a first signal via a single line coupling to a touch sensor and simultaneously senses, when present, a second signal that is uniquely associated with a user. The DSC processes the first signal and/or the second signal to generate a digital signal that is representative of an electrical characteristic of the touch sensor. The processing module executes operational instructions (stored in the memory) to process the digital signal to detect interaction of the user with the touch sensor and to determine whether the interaction of the user with the touch sensor compares favorably with authorization. When not authorized, the processing module aborts execution of operation(s) associated with the interaction of the user with the touch sensor. Alternatively, when authorized, the processing module facilitates execution of the operation(s).

CROSS REFERENCE TO RELATED PATENTS

The present U.S. Utility patent application claims priority pursuant to35 U.S.C. § 120 as a continuation of U.S. Utility application Ser. No.17/082,616, entitled “IDENTIFICATION IN TOUCH SYSTEMS,” filed Oct. 28,2020, pending, which is a continuation of U.S. Utility application Ser.No. 16/131,990, entitled “IDENTIFICATION IN TOUCH SYSTEMS,” filed Sep.14, 2018, now U.S. Pat. No. 10,845,985 on Nov. 24, 2020, all of whichare hereby incorporated herein by reference in their entirety and madepart of the present U.S. Utility patent application for all purposes.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC

Not Applicable.

BACKGROUND OF THE INVENTION Technical Field of the Invention

This invention relates generally to data communication systems and moreparticularly to sensed data collection and/or communication.

Description of Related Art

Sensors are used in a wide variety of applications ranging from in-homeautomation, to industrial systems, to health care, to transportation,and so on. For example, sensors are placed in bodies, automobiles,airplanes, boats, ships, trucks, motorcycles, cell phones, televisions,touchscreens, industrial plants, appliances, motors, checkout counters,etc. for the variety of applications.

In general, a sensor converts a physical quantity into an electrical oroptical signal. For example, a sensor converts a physical phenomenon,such as a biological condition, a chemical condition, an electriccondition, an electromagnetic condition, a temperature, a magneticcondition, mechanical motion (position, velocity, acceleration, force,pressure), an optical condition, and/or a radioactivity condition, intoan electrical signal.

A sensor includes a transducer, which functions to convert one form ofenergy (e.g., force) into another form of energy (e.g., electricalsignal). There are a variety of transducers to support the variousapplications of sensors. For example, a transducer is capacitor, apiezoelectric transducer, a piezoresistive transducer, a thermaltransducer, a thermal-couple, a photoconductive transducer such as aphotoresistor, a photodiode, and/or phototransistor.

A sensor circuit is coupled to a sensor to provide the sensor with powerand to receive the signal representing the physical phenomenon from thesensor. The sensor circuit includes at least three electricalconnections to the sensor: one for a power supply; another for a commonvoltage reference (e.g., ground); and a third for receiving the signalrepresenting the physical phenomenon. The signal representing thephysical phenomenon will vary from the power supply voltage to ground asthe physical phenomenon changes from one extreme to another (for therange of sensing the physical phenomenon).

The sensor circuits provide the received sensor signals to one or morecomputing devices for processing. A computing device is known tocommunicate data, process data, and/or store data. The computing devicemay be a cellular phone, a laptop, a tablet, a personal computer (PC), awork station, a video game device, a server, and/or a data center thatsupport millions of web searches, stock trades, or on-line purchasesevery hour.

The computing device processes the sensor signals for a variety ofapplications. For example, the computing device processes sensor signalsto determine temperatures of a variety of items in a refrigerated truckduring transit. As another example, the computing device processes thesensor signals to determine a touch on a touch screen. As yet anotherexample, the computing device processes the sensor signals to determinevarious data points in a production line of a product.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present invention;

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice in accordance with the present invention;

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present invention;

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present invention;

FIG. 5A is a schematic plot diagram of a computing subsystem inaccordance with the present invention;

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 6 is a schematic block diagram of a drive center circuit inaccordance with the present invention;

FIG. 6A is a schematic block diagram of another embodiment of a drivesense circuit in accordance with the present invention;

FIG. 7 is an example of a power signal graph in accordance with thepresent invention;

FIG. 8 is an example of a sensor graph in accordance with the presentinvention;

FIG. 9 is a schematic block diagram of another example of a power signalgraph in accordance with the present invention;

FIG. 10 is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 11 is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 11A is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit in accordance with the present invention;

FIG. 13 is a schematic block diagram of another embodiment of adrive-sense circuit in accordance with the present invention;

FIG. 14 is a schematic block diagram of an embodiment of a useridentification capable touch sensor implemented with e-pens inaccordance with the present invention;

FIG. 15 is a schematic block diagram of an embodiment of a useridentification capable touch sensor implemented with conductive matsassociated with users in accordance with the present invention;

FIG. 16 is a schematic block diagram of an embodiment of a useridentification capable touch sensor implemented with seats associatedwith users in accordance with the present invention;

FIG. 17 is a schematic block diagram of an embodiment of a useridentification capable touch sensor implemented with drive-sense circuitinterfaces associated with users in accordance with the presentinvention;

FIG. 18 is a schematic block diagram of an embodiment of a useridentification capable touch sensor implemented within an automobile inaccordance with the present invention;

FIG. 19 is a schematic block diagram of another embodiment of a useridentification capable touch sensor implemented within an automobile inaccordance with the present invention;

FIG. 20 is a schematic block diagram of an embodiment of a useridentification capable touch sensor in accordance with the presentinvention;

FIG. 21 is a schematic block diagram of another embodiment of a useridentification capable touch sensor in accordance with the presentinvention;

FIG. 22 is a schematic block diagram of an embodiment of a method forexecution by one or more devices in accordance with the presentinvention;

FIG. 23 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 24 is a schematic block diagram of an embodiment of a portion of atouch sensor that includes two touch sensors in accordance with thepresent invention;

FIG. 25 is a schematic block diagram of an embodiment of a touch sensorthat includes three touch sensors in accordance with the presentinvention;

FIG. 26 is a schematic block diagram of an embodiment of a that includesn touch sensors in accordance with the present invention, where n is apositive integer greater than or equal to 3;

FIG. 27 is a schematic block diagram of an embodiment of a touch sensorsystem in accordance with the present invention;

FIG. 28 is a schematic block diagram of another embodiment of a touchsensor system in accordance with the present invention;

FIG. 29A is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 29B is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 30A is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 30B is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 31 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 32 is a schematic block diagram of an embodiment of a vehicleimplemented with user-interactive glass feature in accordance with thepresent invention;

FIG. 33 is a schematic block diagram of an embodiment of a shower stallimplemented with user-interactive glass feature in accordance with thepresent invention;

FIG. 34 is a schematic block diagram of an embodiment of auser-interactive glass feature implemented with one or more identifiersin accordance with the present invention;

FIG. 35 is a schematic block diagram of an embodiment of a steeringwheel implemented with a touch sensor in accordance with the presentinvention;

FIG. 36 is a schematic block diagram of another embodiment of a steeringwheel implemented with a touch sensor in accordance with the presentinvention;

FIG. 37 is a schematic block diagram of an embodiment of a field of viewuser-interactive glass feature in accordance with the present invention;

FIG. 38 is a schematic block diagram of another embodiment of a field ofview user-interactive glass feature in accordance with the presentinvention;

FIG. 39 is a schematic block diagram of another embodiment of a field ofview user-interactive glass feature in accordance with the presentinvention;

FIG. 40 is a schematic block diagram of another embodiment of a field ofview user-interactive glass feature in accordance with the presentinvention;

FIG. 41 is a schematic block diagram of an embodiment of anotherembodiment of a method for execution by one or more devices inaccordance with the present invention;

FIG. 42 is a schematic block diagram of an embodiment of a touchscreenimplemented with an external controller in accordance with the presentinvention;

FIG. 43 is a schematic block diagram of various embodiment oftouchscreens implemented with external controllers in accordance withthe present invention;

FIG. 44 is a schematic block diagram of an embodiment of a touchscreenimplemented with one or more touch sensors implemented in touchscreen'sbezel the in accordance with the present invention;

FIG. 45 is a schematic block diagram of an embodiment of anotherembodiment of a method for execution by one or more devices inaccordance with the present invention;

FIG. 46 is a schematic block diagram of an embodiment of anotherembodiment of a method for execution by one or more devices inaccordance with the present invention;

FIG. 47 is a schematic block diagram of an embodiment of a radial tirein accordance with the present invention;

FIG. 48 is a schematic block diagram of an embodiment of a variousdegrees of inflation of a tire in accordance with the present invention;

FIG. 49 is a schematic block diagram of an embodiment of a tiremonitoring system in accordance with the present invention;

FIG. 50 is a schematic block diagram of another embodiment of a tiremonitoring system in accordance with the present invention;

FIG. 51 is a schematic block diagram of an embodiment of tire profilemonitoring in accordance with the present invention;

FIG. 52 is a schematic block diagram of another embodiment of a tiremonitoring system in accordance with the present invention;

FIG. 53 is a schematic block diagram of another embodiment of a tiremonitoring system in accordance with the present invention; and

FIG. 54 is a schematic block diagram of another embodiment of a tiremonitoring system in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem 10 that includes a plurality of computing. devices 12-10, one ormore servers 22, one or more databases 24, one or more networks 26, aplurality of drive-sense circuits 28, a plurality of sensors 30, and aplurality of actuators 32. Computing devices 14 include a touch screen16 with sensors and drive-sensor circuits and computing devices 18include a touch & tactic screen 20 that includes sensors, actuators, anddrive-sense circuits.

A sensor 30 functions to convert a physical input into an electricaloutput and/or an optical output. The physical input of a sensor may beone of a variety of physical input conditions. For example, the physicalcondition includes one or more of, but is not limited to, acoustic waves(e.g., amplitude, phase, polarization, spectrum, and/or wave velocity);a biological and/or chemical condition (e.g., fluid concentration,level, composition, etc.); an electric condition (e.g., charge, voltage,current, conductivity, permittivity, eclectic field, which includesamplitude, phase, and/or polarization); a magnetic condition (e.g.,flux, permeability, magnetic field, which amplitude, phase, and/orpolarization); an optical condition (e.g., refractive index,reflectivity, absorption, etc.); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). For example, piezoelectric sensorconverts force or pressure into an eclectic signal. As another example,a microphone converts audible acoustic waves into electrical signals.

There are a variety of types of sensors to sense the various types ofphysical conditions. Sensor types include, but are not limited to,capacitor sensors, inductive sensors, accelerometers, piezoelectricsensors, light sensors, magnetic field sensors, ultrasonic sensors,temperature sensors, infrared (IR) sensors, touch sensors, proximitysensors, pressure sensors, level sensors, smoke sensors, and gassensors. In many ways, sensors function as the interface between thephysical world and the digital world by converting real world conditionsinto digital signals that are then processed by computing devices for avast number of applications including, but not limited to, medicalapplications, production automation applications, home environmentcontrol, public safety, and so on.

The various types of sensors have a variety of sensor characteristicsthat are factors in providing power to the sensors, receiving signalsfrom the sensors, and/or interpreting the signals from the sensors. Thesensor characteristics include resistance, reactance, powerrequirements, sensitivity, range, stability, repeatability, linearity,error, response time, and/or frequency response. For example, theresistance, reactance, and/or power requirements are factors indetermining drive circuit requirements. As another example, sensitivity,stability, and/or linear are factors for interpreting the measure of thephysical condition based on the received electrical and/or opticalsignal (e.g., measure of temperature, pressure, etc.).

An actuator 32 converts an electrical input into a physical output. Thephysical output of an actuator may be one of a variety of physicaloutput conditions. For example, the physical output condition includesone or more of, but is not limited to, acoustic waves (e.g., amplitude,phase, polarization, spectrum, and/or wave velocity); a magneticcondition (e.g., flux, permeability, magnetic field, which amplitude,phase, and/or polarization); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). As an example, a piezoelectric actuatorconverts voltage into force or pressure. As another example, a speakerconverts electrical signals into audible acoustic waves.

An actuator 32 may be one of a variety of actuators. For example, anactuator 32 is one of a comb drive, a digital micro-mirror device, anelectric motor, an electroactive polymer, a hydraulic cylinder, apiezoelectric actuator, a pneumatic actuator, a screw jack, aservomechanism, a solenoid, a stepper motor, a shape-memory allow, athermal bimorph, and a hydraulic actuator.

The various types of actuators have a variety of actuatorscharacteristics that are factors in providing power to the actuator andsending signals to the actuators for desired performance. The actuatorcharacteristics include resistance, reactance, power requirements,sensitivity, range, stability, repeatability, linearity, error, responsetime, and/or frequency response. For example, the resistance, reactance,and power requirements are factors in determining drive circuitrequirements. As another example, sensitivity, stability, and/or linearare factors for generating the signaling to send to the actuator toobtain the desired physical output condition.

The computing devices 12, 14, and 18 may each be a portable computingdevice and/or a fixed computing device. A portable computing device maybe a social networking device, a gaming device, a cell phone, a smartphone, a digital assistant, a digital music player, a digital videoplayer, a laptop computer, a handheld computer, a tablet, a video gamecontroller, and/or any other portable device that includes a computingcore. A fixed computing device may be a computer (PC), a computerserver, a cable set-top box, a satellite receiver, a television set, aprinter, a fax machine, home entertainment equipment, a video gameconsole, and/or any type of home or office computing equipment. Thecomputing devices 12, 14, and 18 will be discussed in greater detailwith reference to one or more of FIGS. 2-4.

A server 22 is a special type of computing device that is optimized forprocessing large amounts of data requests in parallel. A server 22includes similar components to that of the computing devices 12, 14,and/or 18 with more robust processing modules, more main memory, and/ormore hard drive memory (e.g., solid state, hard drives, etc.). Further,a server 22 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a server may be a standalone separate computing device and/ormay be a cloud computing device.

A database 24 is a special type of computing device that is optimizedfor large scale data storage and retrieval. A database 24 includessimilar components to that of the computing devices 12, 14, and/or 18with more hard drive memory (e.g., solid state, hard drives, etc.) andpotentially with more processing modules and/or main memory. Further, adatabase 24 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a database 24 may be a standalone separate computing deviceand/or may be a cloud computing device.

The network 26 includes one more local area networks (LAN) and/or one ormore wide area networks WAN), which may be a public network and/or aprivate network. A LAN may be a wireless-LAN (e.g., Wi-Fi access point,Bluetooth, ZigBee, etc.) and/or a wired network (e.g., Firewire,Ethernet, etc.). A WAN may be a wired and/or wireless WAN. For example,a LAN may be a personal home or business's wireless network and a WAN isthe Internet, cellular telephone infrastructure, and/or satellitecommunication infrastructure.

In an example of operation, computing device 12-1 communicates with aplurality of drive-sense circuits 28, which, in turn, communicate with aplurality of sensors 30. The sensors 30 and/or the drive-sense circuits28 are within the computing device 12-1 and/or external to it. Forexample, the sensors 30 may be external to the computing device 12-1 andthe drive-sense circuits are within the computing device 12-1. Asanother example, both the sensors 30 and the drive-sense circuits 28 areexternal to the computing device 12-1. When the drive-sense circuits 28are external to the computing device, they are coupled to the computingdevice 12-1 via wired and/or wireless communication links as will bediscussed in greater detail with reference to one or more of FIGS.5A-5C.

The computing device 12-1 communicates with the drive-sense circuits 28to; (a) turn them on, (b) obtain data from the sensors (individuallyand/or collectively), (c) instruct the drive sense circuit on how tocommunicate the sensed data to the computing device 12-1, (d) providesignaling attributes (e.g., DC level, AC level, frequency, power level,regulated current signal, regulated voltage signal, regulation of animpedance, frequency patterns for various sensors, different frequenciesfor different sensing applications, etc.) to use with the sensors,and/or (e) provide other commands and/or instructions.

As a specific example, the sensors 30 are distributed along a pipelineto measure flow rate and/or pressure within a section of the pipeline.The drive-sense circuits 28 have their own power source (e.g., battery,power supply, etc.) and are proximally located to their respectivesensors 30. At desired time intervals (milliseconds, seconds, minutes,hours, etc.), the drive-sense circuits 28 provide a regulated sourcesignal or a power signal to the sensors 30. An electrical characteristicof the sensor 30 affects the regulated source signal or power signal,which is reflective of the condition (e.g., the flow rate and/or thepressure) that sensor is sensing.

The drive-sense circuits 28 detect the effects on the regulated sourcesignal or power signals as a result of the electrical characteristics ofthe sensors. The drive-sense circuits 28 then generate signalsrepresentative of change to the regulated source signal or power signalbased on the detected effects on the power signals. The changes to theregulated source signals or power signals are representative of theconditions being sensed by the sensors 30.

The drive-sense circuits 28 provide the representative signals of theconditions to the computing device 12-1. A representative signal may bean analog signal or a digital signal. In either case, the computingdevice 12-1 interprets the representative signals to determine thepressure and/or flow rate at each sensor location along the pipeline.The computing device may then provide this information to the server 22,the database 24, and/or to another computing device for storing and/orfurther processing.

As another example of operation, computing device 12-2 is coupled to adrive-sense circuit 28, which is, in turn, coupled to a senor 30. Thesensor 30 and/or the drive-sense circuit 28 may be internal and/orexternal to the computing device 12-2. In this example, the sensor 30 issensing a condition that is particular to the computing device 12-2. Forexample, the sensor 30 may be a temperature sensor, an ambient lightsensor, an ambient noise sensor, etc. As described above, wheninstructed by the computing device 12-2 (which may be a default settingfor continuous sensing or at regular intervals), the drive-sense circuit28 provides the regulated source signal or power signal to the sensor 30and detects an effect to the regulated source signal or power signalbased on an electrical characteristic of the sensor. The drive-sensecircuit generates a representative signal of the affect and sends it tothe computing device 12-2.

In another example of operation, computing device 12-3 is coupled to aplurality of drive-sense circuits 28 that are coupled to a plurality ofsensors 30 and is coupled to a plurality of drive-sense circuits 28 thatare coupled to a plurality of actuators 32. The generally functionalityof the drive-sense circuits 28 coupled to the sensors 30 in accordancewith the above description.

Since an actuator 32 is essentially an inverse of a sensor in that anactuator converts an electrical signal into a physical condition, whilea sensor converts a physical condition into an electrical signal, thedrive-sense circuits 28 can be used to power actuators 32. Thus, in thisexample, the computing device 12-3 provides actuation signals to thedrive-sense circuits 28 for the actuators 32. The drive-sense circuitsmodulate the actuation signals on to power signals or regulated controlsignals, which are provided to the actuators 32. The actuators 32 arepowered from the power signals or regulated control signals and producethe desired physical condition from the modulated actuation signals.

As another example of operation, computing device 12-x is coupled to adrive-sense circuit 28 that is coupled to a sensor 30 and is coupled toa drive-sense circuit 28 that is coupled to an actuator 32. In thisexample, the sensor 30 and the actuator 32 are for use by the computingdevice 12-x. For example, the sensor 30 may be a piezoelectricmicrophone and the actuator 32 may be a piezoelectric speaker.

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice 12 (e.g., any one of 12-1 through 12-x). The computing device 12includes a core control module 40, one or more processing modules 42,one or more main memories 44, cache memory 46, a video graphicsprocessing module 48, a display 50, an Input-Output (I/O) peripheralcontrol module 52, one or more input interface modules 56, one or moreoutput interface modules 58, one or more network interface modules 60,and one or more memory interface modules 62. A processing module 42 isdescribed in greater detail at the end of the detailed description ofthe invention section and, in an alternative embodiment, has a directionconnection to the main memory 44. In an alternate embodiment, the corecontrol module 40 and the I/O and/or peripheral control module 52 areone module, such as a chipset, a quick path interconnect (QPI), and/oran ultra-path interconnect (UPI).

Each of the main memories 44 includes one or more Random Access Memory(RAM) integrated circuits, or chips. For example, a main memory 44includes four DDR4 (4th generation of double data rate) RAM chips, eachrunning at a rate of 2,400 MHz. In general, the main memory 44 storesdata and operational instructions most relevant for the processingmodule 42. For example, the core control module 40 coordinates thetransfer of data and/or operational instructions from the main memory 44and the memory 64-66. The data and/or operational instructions retrievefrom memory 64-66 are the data and/or operational instructions requestedby the processing module or will most likely be needed by the processingmodule. When the processing module is done with the data and/oroperational instructions in main memory, the core control module 40coordinates sending updated data to the memory 64-66 for storage.

The memory 64-66 includes one or more hard drives, one or more solidstate memory chips, and/or one or more other large capacity storagedevices that, in comparison to cache memory and main memory devices,is/are relatively inexpensive with respect to cost per amount of datastored. The memory 64-66 is coupled to the core control module 40 viathe I/O and/or peripheral control module 52 and via one or more memoryinterface modules 62. In an embodiment, the I/O and/or peripheralcontrol module 52 includes one or more Peripheral Component Interface(PCI) buses to which peripheral components connect to the core controlmodule 40. A memory interface module 62 includes a software driver and ahardware connector for coupling a memory device to the I/O and/orperipheral control module 52. For example, a memory interface 62 is inaccordance with a Serial Advanced Technology Attachment (SATA) port.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and the network(s) 26 via the I/O and/orperipheral control module 52, the network interface module(s) 60, and anetwork card 68 or 70. A network card 68 or 70 includes a wirelesscommunication unit or a wired communication unit. A wirelesscommunication unit includes a wireless local area network (WLAN)communication device, a cellular communication device, a Bluetoothdevice, and/or a ZigBee communication device. A wired communication unitincludes a Gigabit LAN connection, a Firewire connection, and/or aproprietary computer wired connection. A network interface module 60includes a software driver and a hardware connector for coupling thenetwork card to the I/O and/or peripheral control module 52. Forexample, the network interface module 60 is in accordance with one ormore versions of IEEE 802.11, cellular telephone protocols, 10/100/1000Gigabit LAN protocols, etc.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and input device(s) 72 via the input interfacemodule(s) 56 and the I/O and/or peripheral control module 52. An inputdevice 72 includes a keypad, a keyboard, control switches, a touchpad, amicrophone, a camera, etc. An input interface module 56 includes asoftware driver and a hardware connector for coupling an input device tothe I/O and/or peripheral control module 52. In an embodiment, an inputinterface module 56 is in accordance with one or more Universal SerialBus (USB) protocols.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and output device(s) 74 via the output interfacemodule(s) 58 and the I/O and/or peripheral control module 52. An outputdevice 74 includes a speaker, etc. An output interface module 58includes a software driver and a hardware connector for coupling anoutput device to the I/O and/or peripheral control module 52. In anembodiment, an output interface module 56 is in accordance with one ormore audio codec protocols.

The processing module 42 communicates directly with a video graphicsprocessing module 48 to display data on the display 50. The display 50includes an LED (light emitting diode) display, an LCD (liquid crystaldisplay), and/or other type of display technology. The display has aresolution, an aspect ratio, and other features that affect the qualityof the display. The video graphics processing module 48 receives datafrom the processing module 42, processes the data to produce rendereddata in accordance with the characteristics of the display, and providesthe rendered data to the display 50.

FIG. 2 further illustrates sensors 30 and actuators 32 coupled todrive-sense circuits 28, which are coupled to the input interface module56 (e.g., USB port). Alternatively, one or more of the drive-sensecircuits 28 is coupled to the computing device via a wireless networkcard (e.g., WLAN) or a wired network card (e.g., Gigabit LAN). While notshown, the computing device 12 further includes a BIOS (Basic InputOutput System) memory coupled to the core control module 40.

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice 14 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touch screen 16, an Input-Output (I/O)peripheral control module 52, one or more input interface modules 56,one or more output interface modules 58, one or more network interfacemodules 60, and one or more memory interface modules 62. The touchscreen 16 includes a touch screen display 80, a plurality of sensors 30,a plurality of drive-sense circuits (DSC), and a touch screen processingmodule 82.

Computing device 14 operates similarly to computing device 12 of FIG. 2with the addition of a touch screen as an input device. The touch screenincludes a plurality of sensors (e.g., electrodes, capacitor sensingcells, capacitor sensors, inductive sensor, etc.) to detect a proximaltouch of the screen. For example, when one or more fingers touches thescreen, capacitance of sensors proximal to the touch(es) are affected(e.g., impedance changes). The drive-sense circuits (DSC) coupled to theaffected sensors detect the change and provide a representation of thechange to the touch screen processing module 82, which may be a separateprocessing module or integrated into the processing module 42.

The touch screen processing module 82 processes the representativesignals from the drive-sense circuits (DSC) to determine the location ofthe touch(es). This information is inputted to the processing module 42for processing as an input. For example, a touch represents a selectionof a button on screen, a scroll function, a zoom in-out function, etc.

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice 18 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touch and tactile screen 20, anInput-Output (I/O) peripheral control module 52, one or more inputinterface modules 56, one or more output interface modules 58, one ormore network interface modules 60, and one or more memory interfacemodules 62. The touch and tactile screen 20 includes a touch and tactilescreen display 90, a plurality of sensors 30, a plurality of actuators32, a plurality of drive-sense circuits (DSC), a touch screen processingmodule 82, and a tactile screen processing module 92.

Computing device 18 operates similarly to computing device 14 of FIG. 3with the addition of a tactile aspect to the screen 20 as an outputdevice. The tactile portion of the screen 20 includes the plurality ofactuators (e.g., piezoelectric transducers to create vibrations,solenoids to create movement, etc.) to provide a tactile feel to thescreen 20. To do so, the processing module creates tactile data, whichis provided to the appropriate drive-sense circuits (DSC) via thetactile screen processing module 92, which may be a stand-aloneprocessing module or integrated into processing module 42. Thedrive-sense circuits (DSC) convert the tactile data into drive-actuatesignals and provide them to the appropriate actuators to create thedesired tactile feel on the screen 20.

FIG. 5A is a schematic plot diagram of a computing subsystem 25 thatincludes a sensed data processing module 65, a plurality ofcommunication modules 61A-x, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1. The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing devices in which processing modules 42A-xreside.

A drive-sense circuit 28 (or multiple drive-sense circuits), aprocessing module (e.g., 41A), and a communication module (e.g., 61A)are within a common computing device. Each grouping of a drive-sensecircuit(s), processing module, and communication module is in a separatecomputing device. A communication module 61A-x is constructed inaccordance with one or more wired communication protocol and/or one ormore wireless communication protocols that is/are in accordance with theone or more of the Open System Interconnection (OSI) model, theTransmission Control Protocol/Internet Protocol (TCP/IP) model, andother communication protocol module.

In an example of operation, a processing module (e.g., 42A) provides acontrol signal to its corresponding drive-sense circuit 28. Theprocessing module 42A may generate the control signal, receive it fromthe sensed data processing module 65, or receive an indication from thesensed data processing module 65 to generate the control signal. Thecontrol signal enables the drive-sense circuit 28 to provide a drivesignal to its corresponding sensor. The control signal may furtherinclude a reference signal having one or more frequency components tofacilitate creation of the drive signal and/or interpreting a sensedsignal received from the sensor.

Based on the control signal, the drive-sense circuit 28 provides thedrive signal to its corresponding sensor (e.g., 1) on a drive & senseline. While receiving the drive signal (e.g., a power signal, aregulated source signal, etc.), the sensor senses a physical condition1-x (e.g., acoustic waves, a biological condition, a chemical condition,an electric condition, a magnetic condition, an optical condition, athermal condition, and/or a mechanical condition). As a result of thephysical condition, an electrical characteristic (e.g., impedance,voltage, current, capacitance, inductance, resistance, reactance, etc.)of the sensor changes, which affects the drive signal. Note that if thesensor is an optical sensor, it converts a sensed optical condition intoan electrical characteristic.

The drive-sense circuit 28 detects the effect on the drive signal viathe drive & sense line and processes the affect to produce a signalrepresentative of power change, which may be an analog or digitalsignal. The processing module 42A receives the signal representative ofpower change, interprets it, and generates a value representing thesensed physical condition. For example, if the sensor is sensingpressure, the value representing the sensed physical condition is ameasure of pressure (e.g., x PSI (pounds per square inch)).

In accordance with a sensed data process function (e.g., algorithm,application, etc.), the sensed data processing module 65 gathers thevalues representing the sensed physical conditions from the processingmodules. Since the sensors 1-x may be the same type of sensor (e.g., apressure sensor), may each be different sensors, or a combinationthereof; the sensed physical conditions may be the same, may each bedifferent, or a combination thereof. The sensed data processing module65 processes the gathered values to produce one or more desired results.For example, if the computing subsystem 25 is monitoring pressure alonga pipeline, the processing of the gathered values indicates that thepressures are all within normal limits or that one or more of the sensedpressures is not within normal limits.

As another example, if the computing subsystem 25 is used in amanufacturing facility, the sensors are sensing a variety of physicalconditions, such as acoustic waves (e.g., for sound proofing, soundgeneration, ultrasound monitoring, etc.), a biological condition (e.g.,a bacterial contamination, etc.) a chemical condition (e.g.,composition, gas concentration, etc.), an electric condition (e.g.,current levels, voltage levels, electro-magnetic interference, etc.), amagnetic condition (e.g., induced current, magnetic field strength,magnetic field orientation, etc.), an optical condition (e.g., ambientlight, infrared, etc.), a thermal condition (e.g., temperature, etc.),and/or a mechanical condition (e.g., physical position, force, pressure,acceleration, etc.).

The computing subsystem 25 may further include one or more actuators inplace of one or more of the sensors and/or in addition to the sensors.When the computing subsystem 25 includes an actuator, the correspondingprocessing module provides an actuation control signal to thecorresponding drive-sense circuit 28. The actuation control signalenables the drive-sense circuit 28 to provide a drive signal to theactuator via a drive & actuate line (e.g., similar to the drive & senseline, but for the actuator). The drive signal includes one or morefrequency components and/or amplitude components to facilitate a desiredactuation of the actuator.

In addition, the computing subsystem 25 may include an actuator andsensor working in concert. For example, the sensor is sensing thephysical condition of the actuator. In this example, a drive-sensecircuit provides a drive signal to the actuator and another drive sensesignal provides the same drive signal, or a scaled version of it, to thesensor. This allows the sensor to provide near immediate and continuoussensing of the actuator's physical condition. This further allows forthe sensor to operate at a first frequency and the actuator to operateat a second frequency.

In an embodiment, the computing subsystem is a stand-alone system for awide variety of applications (e.g., manufacturing, pipelines, testing,monitoring, security, etc.). In another embodiment, the computingsubsystem 25 is one subsystem of a plurality of subsystems forming alarger system. For example, different subsystems are employed based ongeographic location. As a specific example, the computing subsystem 25is deployed in one section of a factory and another computing subsystemis deployed in another part of the factory. As another example,different subsystems are employed based function of the subsystems. As aspecific example, one subsystem monitors a city's traffic lightoperation and another subsystem monitors the city's sewage treatmentplants.

Regardless of the use and/or deployment of the computing system, thephysical conditions it is sensing, and/or the physical conditions it isactuating, each sensor and each actuator (if included) is driven andsensed by a single line as opposed to separate drive and sense lines.This provides many advantages including, but not limited to, lower powerrequirements, better ability to drive high impedance sensors, lower lineto line interference, and/or concurrent sensing functions.

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1. The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing device, devices, in which processingmodules 42A-x reside.

In an embodiment, the drive-sense circuits 28, the processing modules,and the communication module are within a common computing device. Forexample, the computing device includes a central processing unit thatincludes a plurality of processing modules. The functionality andoperation of the sensed data processing module 65, the communicationmodule 61, the processing modules 42A-x, the drive sense circuits 28,and the sensors 1-x are as discussed with reference to FIG. 5A.

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a processing module 42, a plurality of drivesense circuits 28, and a plurality of sensors 1-x, which may be sensors30 of FIG. 1. The sensed data processing module 65 is one or moreprocessing modules within one or more servers 22 and/or one moreprocessing modules in one or more computing devices that are differentthan the computing device in which the processing module 42 resides.

In an embodiment, the drive-sense circuits 28, the processing module,and the communication module are within a common computing device. Thefunctionality and operation of the sensed data processing module 65, thecommunication module 61, the processing module 42, the drive sensecircuits 28, and the sensors 1-x are as discussed with reference to FIG.5A.

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a referencesignal circuit 100, a plurality of drive sense circuits 28, and aplurality of sensors 30. The processing module 42 includes a drive-senseprocessing block 104, a drive-sense control block 102, and a referencecontrol block 106. Each block 102-106 of the processing module 42 may beimplemented via separate modules of the processing module, may be acombination of software and hardware within the processing module,and/or may be field programmable modules within the processing module42.

In an example of operation, the drive-sense control block 104 generatesone or more control signals to activate one or more of the drive-sensecircuits 28. For example, the drive-sense control block 102 generates acontrol signal that enables of the drive-sense circuits 28 for a givenperiod of time (e.g., 1 second, 1 minute, etc.). As another example, thedrive-sense control block 102 generates control signals to sequentiallyenable the drive-sense circuits 28. As yet another example, thedrive-sense control block 102 generates a series of control signals toperiodically enable the drive-sense circuits 28 (e.g., enabled onceevery second, every minute, every hour, etc.).

Continuing with the example of operation, the reference control block106 generates a reference control signal that it provides to thereference signal circuit 100. The reference signal circuit 100generates, in accordance with the control signal, one or more referencesignals for the drive-sense circuits 28. For example, the control signalis an enable signal, which, in response, the reference signal circuit100 generates a pre-programmed reference signal that it provides to thedrive-sense circuits 28. In another example, the reference signalcircuit 100 generates a unique reference signal for each of thedrive-sense circuits 28. In yet another example, the reference signalcircuit 100 generates a first unique reference signal for each of thedrive-sense circuits 28 in a first group and generates a second uniquereference signal for each of the drive-sense circuits 28 in a secondgroup.

The reference signal circuit 100 may be implemented in a variety ofways. For example, the reference signal circuit 100 includes a DC(direct current) voltage generator, an AC voltage generator, and avoltage combining circuit. The DC voltage generator generates a DCvoltage at a first level and the AC voltage generator generates an ACvoltage at a second level, which is less than or equal to the firstlevel. The voltage combining circuit combines the DC and AC voltages toproduce the reference signal. As examples, the reference signal circuit100 generates a reference signal similar to the signals shown in FIG. 7,which will be subsequently discussed.

As another example, the reference signal circuit 100 includes a DCcurrent generator, an AC current generator, and a current combiningcircuit. The DC current generator generates a DC current a first currentlevel and the AC current generator generates an AC current at a secondcurrent level, which is less than or equal to the first current level.The current combining circuit combines the DC and AC currents to producethe reference signal.

Returning to the example of operation, the reference signal circuit 100provides the reference signal, or signals, to the drive-sense circuits28. When a drive-sense circuit 28 is enabled via a control signal fromthe drive sense control block 102, it provides a drive signal to itscorresponding sensor 30. As a result of a physical condition, anelectrical characteristic of the sensor is changed, which affects thedrive signal. Based on the detected effect on the drive signal and thereference signal, the drive-sense circuit 28 generates a signalrepresentative of the effect on the drive signal.

The drive-sense circuit provides the signal representative of the effecton the drive signal to the drive-sense processing block 104. Thedrive-sense processing block 104 processes the representative signal toproduce a sensed value 97 of the physical condition (e.g., a digitalvalue that represents a specific temperature, a specific pressure level,etc.). The processing module 42 provides the sensed value 97 to anotherapplication running on the computing device, to another computingdevice, and/or to a server 22.

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a pluralityof drive sense circuits 28, and a plurality of sensors 30. Thisembodiment is similar to the embodiment of FIG. 5D with thefunctionality of the drive-sense processing block 104, a drive-sensecontrol block 102, and a reference control block 106 shown in greaterdetail. For instance, the drive-sense control block 102 includesindividual enable/disable blocks 102-1 through 102-y. An enable/disableblock functions to enable or disable a corresponding drive-sense circuitin a manner as discussed above with reference to FIG. 5D.

The drive-sense processing block 104 includes variance determiningmodules 104-1 a through y and variance interpreting modules 104-2 athrough y. For example, variance determining module 104-1 a receives,from the corresponding drive-sense circuit 28, a signal representativeof a physical condition sensed by a sensor. The variance determiningmodule 104-1 a functions to determine a difference from the signalrepresenting the sensed physical condition with a signal representing aknown, or reference, physical condition. The variance interpretingmodule 104-1 b interprets the difference to determine a specific valuefor the sensed physical condition.

As a specific example, the variance determining module 104-1 a receivesa digital signal of 1001 0110 (150 in decimal) that is representative ofa sensed physical condition (e.g., temperature) sensed by a sensor fromthe corresponding drive-sense circuit 28. With 8-bits, there are 2⁸(256) possible signals representing the sensed physical condition.Assume that the units for temperature is Celsius and a digital value of0100 0000 (64 in decimal) represents the known value for 25 degreeCelsius. The variance determining module 104-b 1 determines thedifference between the digital signal representing the sensed value(e.g., 1001 0110, 150 in decimal) and the known signal value of (e.g.,0100 0000, 64 in decimal), which is 0011 0000 (86 in decimal). Thevariance determining module 104-b 1 then determines the sensed valuebased on the difference and the known value. In this example, the sensedvalue equals 25+86*(100/256)=25+33.6=58.6 degrees Celsius.

FIG. 6 is a schematic block diagram of a drive center circuit 28-acoupled to a sensor 30. The drive sense-sense circuit 28 includes apower source circuit 110 and a power signal change detection circuit112. The sensor 30 includes one or more transducers that have varyingelectrical characteristics (e.g., capacitance, inductance, impedance,current, voltage, etc.) based on varying physical conditions 114 (e.g.,pressure, temperature, biological, chemical, etc.), or vice versa (e.g.,an actuator).

The power source circuit 110 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 116 to the sensor 30. The power sourcecircuit 110 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal, a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The power source circuit 110 generates the power signal 116 to include aDC (direct current) component and/or an oscillating component.

When receiving the power signal 116 and when exposed to a condition 114,an electrical characteristic of the sensor affects 118 the power signal.When the power signal change detection circuit 112 is enabled, itdetects the affect 118 on the power signal as a result of the electricalcharacteristic of the sensor. For example, the power signal is a 1.5voltage signal and, under a first condition, the sensor draws 1 milliampof current, which corresponds to an impedance of 1.5 K Ohms. Under asecond conditions, the power signal remains at 1.5 volts and the currentincreases to 1.5 milliamps. As such, from condition 1 to condition 2,the impedance of the sensor changed from 1.5 K Ohms to 1 K Ohms. Thepower signal change detection circuit 112 determines this change andgenerates a representative signal 120 of the change to the power signal.

As another example, the power signal is a 1.5 voltage signal and, undera first condition, the sensor draws 1 milliamp of current, whichcorresponds to an impedance of 1.5 K Ohms. Under a second conditions,the power signal drops to 1.3 volts and the current increases to 1.3milliamps. As such, from condition 1 to condition 2, the impedance ofthe sensor changed from 1.5 K Ohms to 1 K Ohms. The power signal changedetection circuit 112 determines this change and generates arepresentative signal 120 of the change to the power signal.

The power signal 116 includes a DC component 122 and/or an oscillatingcomponent 124 as shown in FIG. 7. The oscillating component 124 includesa sinusoidal signal, a square wave signal, a triangular wave signal, amultiple level signal (e.g., has varying magnitude over time withrespect to the DC component), and/or a polygonal signal (e.g., has asymmetrical or asymmetrical polygonal shape with respect to the DCcomponent). Note that the power signal is shown without affect from thesensor as the result of a condition or changing condition.

In an embodiment, power generating circuit 110 varies frequency of theoscillating component 124 of the power signal 116 so that it can betuned to the impedance of the sensor and/or to be off-set in frequencyfrom other power signals in a system. For example, a capacitancesensor's impedance decreases with frequency. As such, if the frequencyof the oscillating component is too high with respect to thecapacitance, the capacitor looks like a short and variances incapacitances will be missed. Similarly, if the frequency of theoscillating component is too low with respect to the capacitance, thecapacitor looks like an open and variances in capacitances will bemissed.

In an embodiment, the power generating circuit 110 varies magnitude ofthe DC component 122 and/or the oscillating component 124 to improveresolution of sensing and/or to adjust power consumption of sensing. Inaddition, the power generating circuit 110 generates the drive signal110 such that the magnitude of the oscillating component 124 is lessthan magnitude of the DC component 122.

FIG. 6A is a schematic block diagram of a drive center circuit 28-alcoupled to a sensor 30. The drive sense-sense circuit 28-al includes asignal source circuit 111, a signal change detection circuit 113, and apower source 115. The power source 115 (e.g., a battery, a power supply,a current source, etc.) generates a voltage and/or current that iscombined with a signal 117, which is produced by the signal sourcecircuit 111. The combined signal is supplied to the sensor 30.

The signal source circuit 111 may be a voltage supply circuit (e.g., abattery, a linear regulator, an unregulated DC-to-DC converter, etc.) toproduce a voltage-based signal 117, a current supply circuit (e.g., acurrent source circuit, a current mirror circuit, etc.) to produce acurrent-based signal 117, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The signal source circuit 111 generates the signal 117 to include a DC(direct current) component and/or an oscillating component.

When receiving the combined signal (e.g., signal 117 and power from thepower source) and when exposed to a condition 114, an electricalcharacteristic of the sensor affects 119 the signal. When the signalchange detection circuit 113 is enabled, it detects the affect 119 onthe signal as a result of the electrical characteristic of the sensor.

FIG. 8 is an example of a sensor graph that plots an electricalcharacteristic versus a condition. The sensor has a substantially linearregion in which an incremental change in a condition produces acorresponding incremental change in the electrical characteristic. Thegraph shows two types of electrical characteristics: one that increasesas the condition increases and the other that decreases and thecondition increases. As an example of the first type, impedance of atemperature sensor increases and the temperature increases. As anexample of a second type, a capacitance touch sensor decreases incapacitance as a touch is sensed.

FIG. 9 is a schematic block diagram of another example of a power signalgraph in which the electrical characteristic or change in electricalcharacteristic of the sensor is affecting the power signal. In thisexample, the effect of the electrical characteristic or change inelectrical characteristic of the sensor reduced the DC component but hadlittle to no effect on the oscillating component. For example, theelectrical characteristic is resistance. In this example, the resistanceor change in resistance of the sensor decreased the power signal,inferring an increase in resistance for a relatively constant current.

FIG. 10 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor reduced magnitude of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is impedance of a capacitorand/or an inductor. In this example, the impedance or change inimpedance of the sensor decreased the magnitude of the oscillatingsignal component, inferring an increase in impedance for a relativelyconstant current.

FIG. 11 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor shifted frequency of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is reactance of a capacitorand/or an inductor. In this example, the reactance or change inreactance of the sensor shifted frequency of the oscillating signalcomponent, inferring an increase in reactance (e.g., sensor isfunctioning as an integrator or phase shift circuit).

FIG. 11A is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor changes the frequency of theoscillating component but had little to no effect on the DC component.For example, the sensor includes two transducers that oscillate atdifferent frequencies. The first transducer receives the power signal ata frequency of f1 and converts it into a first physical condition. Thesecond transducer is stimulated by the first physical condition tocreate an electrical signal at a different frequency f2. In thisexample, the first and second transducers of the sensor change thefrequency of the oscillating signal component, which allows for moregranular sensing and/or a broader range of sensing.

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit 112 receiving the affected power signal 118 andthe power signal 116 as generated to produce, therefrom, the signalrepresentative 120 of the power signal change. The affect 118 on thepower signal is the result of an electrical characteristic and/or changein the electrical characteristic of a sensor; a few examples of theaffects are shown in FIGS. 8-11A.

In an embodiment, the power signal change detection circuit 112 detect achange in the DC component 122 and/or the oscillating component 124 ofthe power signal 116. The power signal change detection circuit 112 thengenerates the signal representative 120 of the change to the powersignal based on the change to the power signal. For example, the changeto the power signal results from the impedance of the sensor and/or achange in impedance of the sensor. The representative signal 120 isreflective of the change in the power signal and/or in the change in thesensor's impedance.

In an embodiment, the power signal change detection circuit 112 isoperable to detect a change to the oscillating component at a frequency,which may be a phase shift, frequency change, and/or change in magnitudeof the oscillating component. The power signal change detection circuit112 is also operable to generate the signal representative of the changeto the power signal based on the change to the oscillating component atthe frequency. The power signal change detection circuit 112 is furtheroperable to provide feedback to the power source circuit 110 regardingthe oscillating component. The feedback allows the power source circuit110 to regulate the oscillating component at the desired frequency,phase, and/or magnitude.

FIG. 13 is a schematic block diagram of another embodiment of a drivesense circuit 28-b includes a change detection circuit 150, a regulationcircuit 152, and a power source circuit 154. The drive-sense circuit28-b is coupled to the sensor 30, which includes a transducer that hasvarying electrical characteristics (e.g., capacitance, inductance,impedance, current, voltage, etc.) based on varying physical conditions114 (e.g., pressure, temperature, biological, chemical, etc.).

The power source circuit 154 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 158 to the sensor 30. The power sourcecircuit 154 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal or a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal. The power source circuit 154 generates thepower signal 158 to include a DC (direct current) component and anoscillating component.

When receiving the power signal 158 and when exposed to a condition 114,an electrical characteristic of the sensor affects 160 the power signal.When the change detection circuit 150 is enabled, it detects the affect160 on the power signal as a result of the electrical characteristic ofthe sensor 30. The change detection circuit 150 is further operable togenerate a signal 120 that is representative of change to the powersignal based on the detected effect on the power signal.

The regulation circuit 152, when its enabled, generates regulationsignal 156 to regulate the DC component to a desired DC level and/orregulate the oscillating component to a desired oscillating level (e.g.,magnitude, phase, and/or frequency) based on the signal 120 that isrepresentative of the change to the power signal. The power sourcecircuit 154 utilizes the regulation signal 156 to keep the power signalat a desired setting 158 regardless of the electrical characteristic ofthe sensor. In this manner, the amount of regulation is indicative ofthe affect the electrical characteristic had on the power signal.

In an example, the power source circuit 158 is a DC-DC converteroperable to provide a regulated power signal having DC and ACcomponents. The change detection circuit 150 is a comparator and theregulation circuit 152 is a pulse width modulator to produce theregulation signal 156. The comparator compares the power signal 158,which is affected by the sensor, with a reference signal that includesDC and AC components. When the electrical characteristics is at a firstlevel (e.g., a first impedance), the power signal is regulated toprovide a voltage and current such that the power signal substantiallyresembles the reference signal.

When the electrical characteristics changes to a second level (e.g., asecond impedance), the change detection circuit 150 detects a change inthe DC and/or AC component of the power signal 158 and generates therepresentative signal 120, which indicates the changes. The regulationcircuit 152 detects the change in the representative signal 120 andcreates the regulation signal to substantially remove the effect on thepower signal. The regulation of the power signal 158 may be done byregulating the magnitude of the DC and/or AC components, by adjustingthe frequency of AC component, and/or by adjusting the phase of the ACcomponent.

With respect to the operation of various drive-sense circuits asdescribed herein and/or their equivalents, note that the operation ofsuch a drive-sense circuit is operable simultaneously to drive and sensea signal via a single line. In comparison to switched, time-divided,time-multiplexed, etc. operation in which there is switching betweendriving and sensing (e.g., driving at first time, sensing at secondtime, etc.) of different respective signals at separate and distincttimes, the drive-sense circuit is operable simultaneously to performboth driving and sensing of a signal. In some examples, suchsimultaneous driving and sensing is performed via a single line using adrive-sense circuit.

In addition, other alternative implementations of various drive-sensecircuits are described in U.S. Utility patent application Ser. No.16/113,379, entitled “DRIVE SENSE CIRCUIT WITH DRIVE-SENSE LINE,”(Attorney Docket No. SGS00009), filed Aug. 27, 2018, pending. Anyinstantiation of a drive-sense circuit as described herein may beimplemented using any of the various implementations of variousdrive-sense circuits described in U.S. Utility patent application Ser.No. 16/113,379.

In addition, note that the one or more signals provided from adrive-sense circuit (DSC) may be of any of a variety of types. Forexample, such a signal may be based on encoding of one or more bits togenerate one or more coded bits used to generate modulation data (orgenerally, data). For example, a device is configured to perform forwarderror correction (FEC) and/or error checking and correction (ECC) codeof one or more bits to generate one or more coded bits. Examples of FECand/or ECC may include turbo code, convolutional code, turbo trelliscoded modulation (TTCM), low density parity check (LDPC) code,Reed-Solomon (RS) code, BCH (Bose and Ray-Chaudhuri, and Hocquenghem)code, binary convolutional code (BCC), Cyclic Redundancy Check (CRC),and/or any other type of ECC and/or FEC code and/or combination thereof,etc. Note that more than one type of ECC and/or FEC code may be used inany of various implementations including concatenation (e.g., first ECCand/or FEC code followed by second ECC and/or FEC code, etc. such asbased on an inner code/outer code architecture, etc.), parallelarchitecture (e.g., such that first ECC and/or FEC code operates onfirst bits while second ECC and/or FEC code operates on second bits,etc.), and/or any combination thereof.

Also, the one or more coded bits may then undergo modulation or symbolmapping to generate modulation symbols (e.g., the modulation symbols mayinclude data intended for one or more recipient devices, components,elements, etc.). Note that such modulation symbols may be generatedusing any of various types of modulation coding techniques. Examples ofsuch modulation coding techniques may include binary phase shift keying(BPSK), quadrature phase shift keying (QPSK), 8-phase shift keying(PSK), 16 quadrature amplitude modulation (QAM), 32 amplitude and phaseshift keying (APSK), etc., uncoded modulation, and/or any other desiredtypes of modulation including higher ordered modulations that mayinclude even greater number of constellation points (e.g., 1024 QAM,etc.).

In addition, note a signal provided from a DSC may be of a uniquefrequency that is different from signals provided from other DSCs. Also,a signal provided from a DSC may include multiple frequenciesindependently or simultaneously. The frequency of the signal can behopped on a pre-arranged pattern. In some examples, a handshake isestablished between one or more DSCs and one or more processing module(e.g., one or more controllers) such that the one or more DSC is/aredirected by the one or more processing modules regarding which frequencyor frequencies and/or which other one or more characteristics of the oneor more signals to use at one or more respective times and/or in one ormore particular situations.

FIG. 14 is a schematic block diagram of an embodiment 1400 of a useridentification capable touch sensor implemented with e-pens(electronic-pens) in accordance with the present invention. A touchsensor system includes one or more touch sensors 1410. The one or moretouch sensors 1410 may be of any of a variety of one or more typesincluding any one or more of a touchscreen, a button, an electrode, anexternal controller, rows of electrodes, columns of electrodes, a matrixof buttons, an array of buttons, a film that includes any desiredimplementation of components to facilitate touch sensor operation,and/or any other configuration by which interaction with the touchsensor may be performed. Note that such interaction of a user with atouch sensor may correspond to the user touching the touch sensor, theuser being in proximate distance to the touch sensor (e.g., within asufficient proximity to the touch sensor that coupling from the user tothe touch sensor may be performed via capacitively coupling (CC), etc.and/or generally any manner of interacting with the touch sensor that isdetectable based on processing of signals transmitted to and/or sensedfrom the touch sensor). With respect to the various embodiments,implementations, etc. of various respective touch sensors as describedherein, note that they may also be of any such variety of one or moretypes.

One example of such interaction it was with the one or more touchsensors 1410 is via capacitive coupling to a touch sensor. Suchcapacitive coupling may be achieved from a user, via a stylus, an activeelement such as an electronic pen (e-pen), and/or any other elementimplemented to perform capacitive coupling to the touch sensor. In someexamples, note that the one or more touch sensors 1410 are alsoimplemented to detect user interaction based on user touch (e.g., viacapacitive coupling (CC) from a user, such as a user's finger, to theone or more touch sensors 1410).

At the top of the diagram, different respective users interact with oneor more touch sensors 1410 using electronic pens (e-pens). The e-pensare implemented to transmit a signal that is detected by the one or moretouch sensors 1410. When different respective signals are transmittedfrom the different respective e-pens, the one or more touch sensors 1410is implemented to detect which of the e-pens (and correspondingly whichof the users) is interacting with the one or more touch sensors 1410.

At the bottom of the diagram, one or more processing modules 1430 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 1430 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 1430.A first group of one or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 1410.

In addition, a first DSC 28 is implemented to drive and simultaneouslyto sense a first pen signal to an e-pen #1. The e-pen #1 is associatedwith the user #1. A second DSC 28 is implemented to drive andsimultaneously to sense a second pen signal to an e-pen #2. The e-pen #2is associated with the user #2. Note that any number of additional DSCsimplemented to drive and simultaneously sense additional pens signals toadditional e-pens may also be implemented.

In an example of operation and implementation, user #1 uses the e-pen #1to interact with the one or more touch sensors 1410. When doing so, thee-pen #1 transmits the first pen signal that is capacitively coupled viacapacitive coupling (CC) to the one or more touch sensors 1410. The oneor more processing modules 1430 is configured to detect the first pensignal via one or more of the DSCs 28 that are coupled between the oneor more processing modules 1430 and the one or more touch sensors 1410.The one or more processing modules 1430 is configured to discriminatethe first pen signal from the respective signals that are driven fromthe one or more of the DSCs 28 that are coupled between the one or moreprocessing modules 1430 and the one or more touch sensors 1410. The oneor more processing modules 1430 is configured to identify not only theinteraction of an e-pen with the one or more touch sensors 1410, butalso configured to identify which e-pen (e.g., and which e-penassociated with which respective user) is interacting with the one ormore touch sensors 1410.

FIG. 15 is a schematic block diagram of an embodiment 1500 of a useridentification capable touch sensor implemented with conductive matsassociated with users in accordance with the present invention. Notethat the conductive mats may be implemented in the floor in any of avariety of ways. The conductive mats may include one or more of anin-floor sensor, a transducer, an actuator, etc. A touch sensor systemincludes one or more touch sensors 1510. The one or more touch sensors1510 may be of any of a variety of one or more types including any oneor more of a touchscreen, a button, an electrode, an externalcontroller, rows of electrodes, columns of electrodes, a matrix ofbuttons, an array of buttons, and/or any other configuration by whichinteraction with the touch sensor may be performed. With respect to thevarious embodiments, implementations, etc. of various respective touchsensors as described herein, note that they may also be of any suchvariety of one or more types. The one or more touch sensors 1510 areimplemented to detect user interaction based on user touch (e.g., viacapacitive coupling (CC) from a user to the one or more touch sensors1510).

At the top of the diagram, different respective users are associatedwith different respective conductive mats. A conductive mat isimplemented to couple a signal via a user that is detected by the one ormore touch sensors 1510. When different respective signals aretransmitted from the different conductive mats, the one or more touchsensors 1510 is implemented to detect via which of the conductive matsthis signal has been coupled (and correspondingly via which of the usersthis signal has been coupled). This allows the determination of whichuser is interacting with the one or more touch sensors 1510.

At the bottom of the diagram, one or more processing modules 1530 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 1530 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 1530.A first group of one or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 1510.

In addition, a first DSC 28 is implemented to drive and simultaneouslyto sense a first user signal to conductive mat #1. The conductive mat #1is associated with the user #1. A second DSC 28 is implemented to driveand simultaneously to sense a second user signal to conductive mat #2.The conductive mat #2 is associated with the user #2. Note that anynumber of additional DSCs implemented to drive and simultaneously senseadditional user signals to additional conductive mats that mayalternatively be associated with additional users may also beimplemented.

In an example of operation and implementation, user #1 interacts withthe one or more touch sensors 1510 when being associated with (e.g.,standing on) conductive mat #1. When doing so, a first DSC 28 transmitsa first user signal via conductive mat #1 that is capacitively coupledvia capacitive coupling (CC) via the user #1 to the one or more touchsensors 1510. The one or more processing modules 1530 is configured todetect the first user signal via one or more of the DSCs 28 that arecoupled between the one or more processing modules 1530 and the one ormore touch sensors 1510. The one or more processing modules 1530 isconfigured to discriminate the first user signal from the respectivesignals that are driven from the one or more of the DSCs 28 that arecoupled between the one or more processing modules 1530 and the one ormore touch sensors 1510. The one or more processing modules 1530 isconfigured to identify not only the interaction of a user with the oneor more touch sensors 1510, but also configured to identify which user(e.g., and which conductive mat associated with which respective user)is interacting with the one or more touch sensors 1510.

FIG. 16 is a schematic block diagram of an embodiment 1600 of a useridentification capable touch sensor implemented with seats associatedwith users in accordance with the present invention. A touch sensorsystem includes one or more touch sensors 1610. The one or more touchsensors 1610 may be of any of a variety of one or more types includingany one or more of a touchscreen, a button, an electrode, an externalcontroller, rows of electrodes, columns of electrodes, a matrix ofbuttons, an array of buttons, and/or any other configuration by whichinteraction with the touch sensor may be performed. With respect to thevarious embodiments, implementations, etc. of various respective touchsensors as described herein, note that they may also be of any suchvariety of one or more types. The one or more touch sensors 1610 areimplemented to detect user interaction based on user touch (e.g., viacapacitive coupling (CC) from a user to the one or more touch sensors1610).

At the top of the diagram, different respective users are associatedwith different respective seats. A seat is implemented to couple asignal via a user that is detected by the one or more touch sensors1610. When different respective signals are transmitted from thedifferent seats, the one or more touch sensors 1610 is implemented todetect via which of the seats this signal has been coupled (andcorrespondingly via which of the users this signal has been coupled).This allows the determination of which user is interacting with the oneor more touch sensors 1610.

At the bottom of the diagram, one or more processing modules 1630 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 1630 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 1630.A first group of one or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 1610.

In addition, a first DSC 28 is implemented to drive and simultaneouslyto sense a first user signal to seat #1. The seat #1 is associated withthe user #1. A second DSC 28 is implemented to drive and simultaneouslyto sense a second user signal to seat #2. The seat #2 is associated withthe user #2. Note that any number of additional DSCs implemented todrive and simultaneously sense additional user signals to additionalseats that may alternatively be associated with additional users mayalso be implemented.

In an example of operation and implementation, user #1 interacts withthe one or more touch sensors 1610 when being associated with (e.g.,sitting in) seat #1. When doing so, a first DSC 28 transmits a firstuser signal via seat #1 that is capacitively coupled via capacitivecoupling (CC) via the user #1 to the one or more touch sensors 1610. Theone or more processing modules 1630 is configured to detect the firstuser signal via one or more of the DSCs 28 that are coupled between theone or more processing modules 1630 and the one or more touch sensors1610. The one or more processing modules 1630 is configured todiscriminate the first user signal from the respective signals that aredriven from the one or more of the DSCs 28 that are coupled between theone or more processing modules 1630 and the one or more touch sensors1610. The one or more processing modules 1630 is configured to identifynot only the interaction of a user with the one or more touch sensors1610, but also configured to identify which user (e.g., and which seatassociated with which respective user) is interacting with the one ormore touch sensors 1610.

FIG. 17 is a schematic block diagram of an embodiment 1700 of a useridentification capable touch sensor implemented with drive-sense circuitinterfaces associated with users in accordance with the presentinvention. A touch sensor system includes one or more touch sensors1710. The one or more touch sensors 1710 may be of any of a variety ofone or more types including any one or more of a touchscreen, a button,an electrode, an external controller, rows of electrodes, columns ofelectrodes, a matrix of buttons, an array of buttons, and/or any otherconfiguration by which interaction with the touch sensor may beperformed. With respect to the various embodiments, implementations,etc. of various respective touch sensors as described herein, note thatthey may also be of any such variety of one or more types. The one ormore touch sensors 1710 are implemented to detect user interaction basedon user touch (e.g., via capacitive coupling (CC) from a user to the oneor more touch sensors 1710).

At the top of the diagram, different respective users are associatedwith different drive-sense circuit interfaces (DSC I/F). A DSC I/F isimplemented to couple a signal via a user that is detected by the one ormore touch sensors 1710. Examples of such DSC I/F include any means bywhich a signal may be coupled via a user. Examples of a DSC I/F includeone or more of a pen, a conductive mat, a seat, a seat belt, a cellphone, a smart phone, a key fob, a watch, an active wrist-band, apersonal digital assistant (PDA), or a clip-on element. In someexamples, note that the DSC I/F includes a DSC 28 therein (e.g., a DSCI/F includes a DSC 28 therein that is configured to transmit a signalvia a user that is detected by the one or more touch sensors 1710). Ingeneral, a DSC I/F may be viewed as any element, component, etc. that isconfigured to couple a signal via a user that is detected by the one ormore touch sensors 1710. In some examples, such coupling is viacapacitive coupling (CC) from the DSC I/F to the user.

When different respective signals are transmitted from the different DSCI/Fs, the one or more touch sensors 1710 is implemented to detect viawhich of the DSC I/Fs this signal has been coupled (and correspondinglyvia which of the users this signal has been coupled). This allows thedetermination of which user is interacting with the one or more touchsensors 1710.

At the bottom of the diagram, one or more processing modules 1730 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 1730 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 1730.A first group of one or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 1710.

In addition, a first DSC 28 is implemented to drive and simultaneouslyto sense a first user signal to DSC I/F #1. The DSC I/F #1 is associatedwith the user #1. A second DSC 28 is implemented to drive andsimultaneously to sense a second user signal to DSC I/F #2. The DSC I/F#2 is associated with the user #2. Note that any number of additionalDSCs implemented to drive and simultaneously sense additional usersignals to additional DSC I/Fs that may alternatively be associated withadditional users may also be implemented.

In an example of operation and implementation, user #1 interacts withthe one or more touch sensors 1710 when being associated with DSC I/F#1. When doing so, a first DSC 28 transmits a first user signal via DSCI/F #1 that is capacitively coupled via capacitive coupling (CC) via theuser #1 to the one or more touch sensors 1710. The one or moreprocessing modules 1730 is configured to detect the first user signalvia one or more of the DSCs 28 that are coupled between the one or moreprocessing modules 1730 and the one or more touch sensors 1710. The oneor more processing modules 1730 is configured to discriminate the firstuser signal from the respective signals that are driven from the one ormore of the DSCs 28 that are coupled between the one or more processingmodules 1730 and the one or more touch sensors 1710. The one or moreprocessing modules 1730 is configured to identify not only theinteraction of a user with the one or more touch sensors 1710, but alsoconfigured to identify which user (e.g., and which DSC I/F associatedwith which respective user) is interacting with the one or more touchsensors 1710.

In an example of operation and implementation, a touch sensor systemincludes a plurality of touch sensors, a plurality of drive-sensecircuits operably coupled to the plurality of touch sensors, memory thatstores operational instructions, and a processing module operablycoupled to the drive-sense circuit of the plurality of drive-sensecircuits and to the memory.

When enabled, a drive-sense circuit of the plurality of drive-sensecircuits is configured to drive a first signal via a single linecoupling to a touch sensor of the plurality of touch sensors andsimultaneously sense, via the single line, the first signal and, whenpresent, a second signal coupled to the touch sensor of the plurality oftouch sensors, wherein the second signal is uniquely associated with auser. The drive-sense circuit of the plurality of drive-sense circuitsis also configured to process at least one of the first signal or thesecond signal to generate a digital signal that is representative of anelectrical characteristic of the touch sensor of the plurality of touchsensors.

The processing module, when enabled, is configured to execute theoperational instructions to process the digital signal to detectinteraction of the user with the touch sensor. Also, the processingmodule, when enabled, is configured to execute the operationalinstructions to determine whether the interaction of the user with thetouch sensor compares favorably with authorization. Based on unfavorablecomparison of the interaction of the user with the touch sensor with theauthorization, the processing module, when enabled, is configured toexecute the operational instructions to abort execution of one or moreoperations associated with the interaction of the user with the touchsensor.

Alternatively, based on favorable comparison of the interaction of theuser with the touch sensor with the authorization, the processingmodule, when enabled, is configured to execute the operationalinstructions to facilitate execution of the one or more operationsassociated with the interaction of the user with the touch sensor.

In some examples, the drive-sense circuit of the plurality ofdrive-sense circuits, when enabled, is further configured to drive thefirst signal via the single line coupling to the touch sensor of theplurality of touch sensors and simultaneously sense, via the singleline, the first signal and, when present, a third signal coupled to thetouch sensor of the plurality of touch sensors, wherein the third signalis uniquely associated with another user and to process at least one ofthe first signal, the second signal, or the third signal to generate thedigital signal that is representative of the electrical characteristicof the touch sensor of the plurality of touch sensors. The processingmodule, when enabled, is further configured to execute the operationalinstructions to process the digital signal to detect other interactionof the other user with the touch sensor, determine whether the otherinteraction of the other user with the touch sensor compares favorablywith authorization.

Based on unfavorable comparison of the other interaction of the otheruser with the touch sensor with the authorization, the processingmodule, when enabled, is configured to abort execution of one or moreother operations associated with the other interaction of the other userwith the touch sensor. Alternatively, based on favorable comparison ofthe other interaction of the other user with the touch sensor with theauthorization, the processing module, when enabled, is configured tofacilitate execution of the one or more other operations associated withthe other interaction of the other user with the touch sensor.

In even other examples, another drive-sense circuit of the plurality ofdrive-sense circuits, when enabled, is configured to drive a thirdsignal via another single line coupling to another touch sensor of theplurality of touch sensors and simultaneously sense, via the othersingle line, the third signal and, when present at a time that isdifferent than when the second signal is present and sensed via thesingle line by the drive-sense circuit of the plurality of drive-sensecircuits, the second signal coupled to the other touch sensor of theplurality of touch sensors and to process at least one of the thirdsignal or the second signal to generate another digital signal that isrepresentative of another electrical characteristic of the other touchsensor of the plurality of touch sensors.

The processing module, when enabled, is further configured to executethe operational instructions to process the other digital signal todetect other interaction of the user with the other touch sensor and todetermine an angle of approach of the user to the touch sensor systembased on the interaction of the user with the touch sensor and the otherinteraction of the user with the other touch sensor.

Note that the touch sensor system may be implemented using a variety ofmeans include any one or more of a touchscreen, a button, an electrode,an external controller, rows of electrodes, columns of electrodes, amatrix of buttons, and/or an array of buttons.

In addition, in some examples, the drive-sense circuit of the pluralityof drive-sense circuits further includes a power source circuit operablycoupled to the touch sensor of the plurality of touch sensors via thesingle line, wherein, when enabled, the power source circuit isconfigured to provide the first signal that includes an analog signalvia the single line coupling to the touch sensor of the plurality oftouch sensors, and wherein the analog signal includes at least one of aDC (direct current) component or an oscillating component. Thedrive-sense circuit of the plurality of drive-sense circuits furtherincludes a power source change detection circuit operably coupled to thepower source circuit.

When enabled, the power source change detection circuit is configured todetect an effect on the analog signal that is based on the electricalcharacteristic of the touch sensor of the plurality of touch sensors andto generate the digital signal that is representative of the electricalcharacteristic of the touch sensor of the plurality of touch sensors.

In some examples, the power source circuit includes a power source tosource at least one of a voltage or a current to the touch sensor of theplurality of touch sensors via the single line. In some examples, thepower source change detection circuit includes a power source referencecircuit configured to provide at least one of a voltage reference or acurrent reference, and a comparator configured to compare the at leastone of the voltage and the current provided to the touch sensor of theplurality of touch sensors to the at least one of the voltage referenceand the current reference to produce the analog signal.

In addition, in some examples, note that another drive-sense circuit ofthe plurality of drive-sense circuits, when enabled, configured tocouple the second signal to the user via a drive-sense circuit interfacethat includes at least one of a pen, a conductive mat, a seat, a seatbelt, a cell phone, a smart phone, a key fob, a watch, an activewrist-band, a personal digital assistant (PDA), or a clip-on element,and/or any other element via which a signal may be coupled via a uservia capacitively coupling (CC) to one or more touch sensors.

FIG. 18 is a schematic block diagram of an embodiment 1800 of a useridentification capable touch sensor implemented within an automobile inaccordance with the present invention. A touch sensor system includesone or more touch sensors 1810. The one or more touch sensors 1810 maybe of any of a variety of one or more types including any one or more ofa touchscreen, a button, an electrode, an external controller, rows ofelectrodes, columns of electrodes, a matrix of buttons, an array ofbuttons, and/or any other configuration by which interaction with thetouch sensor may be performed. With respect to the various embodiments,implementations, etc. of various respective touch sensors as describedherein, note that they may also be of any such variety of one or moretypes. The one or more touch sensors 1810 are implemented to detect userinteraction based on user touch (e.g., via capacitive coupling (CC) froma user to the one or more touch sensors 1810).

At the top of the diagram, different respective users are associatedwith seats in the vehicle and/or different drive-sense circuitinterfaces (DSC I/F). A seat and/or DSC I/F is implemented to couple asignal via a user that is detected by the one or more touch sensors1810. Examples of such DSC I/F include any means by which a signal maybe coupled via a user. Examples of a DSC I/F include one or more of apen, a conductive mat, a seat, a seat belt, a cell phone, a smart phone,a key fob, a watch, an active wrist-band, a personal digital assistant(PDA), or a clip-on element as described previously. In the context ofthe vehicle, any element within the vehicle that may be associated witha user may alternatively serve as a DSC I/F. For example, a seat withina vehicle may include various types of wiring, electronics, heatingelements, cooling elements, actuators for seats positioning, a seatbelt,etc. Any such elements associated with the seat of the vehicle may serveas a DSC I/F. In an example of operation and implementation, a DSC isconfigured to transmit a signal via the DSC I/F, via a user, such thatthe signal is used to detect user interaction based on user touch (e.g.,via capacitive coupling (CC) from a user to the one or more touchsensors 1810).

In some examples, note that the DSC I/F includes a DSC 28 therein (e.g.,a DSC I/F includes a DSC 28 therein that is configured to transmit asignal via a user that is detected by the one or more touch sensors1810). In general, a DSC I/F may be viewed as any element, component,etc. that is configured to couple a signal via a user that is detectedby the one or more touch sensors 1810. In some examples, such couplingis via capacitive coupling (CC) from the DSC I/F to the user.

At the bottom of the diagram, one or more processing modules 1830 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 1830 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 1830.A first group of one or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 1810.

In addition, a first DSC 28 is implemented to drive and simultaneouslyto sense a first user signal to seat #1 and/or DSC I/F #1. The seat #1and/or DSC I/F #1 is associated with the user #1. A second DSC 28 isimplemented to drive and simultaneously to sense a second user signal toseat #2 and/or DSC I/F #2. The seat #2 and/or DSC I/F #2 is associatedwith the user #2. Note that any number of additional DSCs implemented todrive and simultaneously sense additional user signals to additionalseats and/or DSC I/Fs that may alternatively be associated withadditional users may also be implemented.

In an example of operation and implementation, user #1 interacts withthe one or more touch sensors 1810 when being associated with DSC I/F#1. When doing so, a first DSC 28 transmits a first user signal via DSCI/F #1 that is capacitively coupled via capacitive coupling (CC) via theuser #1 to the one or more touch sensors 1810. The one or moreprocessing modules 1830 is configured to detect the first user signalvia one or more of the DSCs 28 that are coupled between the one or moreprocessing modules 1830 and the one or more touch sensors 1810. The oneor more processing modules 1830 is configured to discriminate the firstuser signal from the respective signals that are driven from the one ormore of the DSCs 28 that are coupled between the one or more processingmodules 1830 and the one or more touch sensors 1810. The one or moreprocessing modules 1830 is configured to identify not only theinteraction of a user with the one or more touch sensors 1810, but alsoconfigured to identify which user (e.g., and which DSC I/F associatedwith which respective user) is interacting with the one or more touchsensors 1810.

FIG. 19 is a schematic block diagram of another embodiment 1900 of auser identification capable touch sensor implemented within anautomobile in accordance with the present invention. A touch sensorsystem includes one or more touch sensors 1910. The one or more touchsensors 1910 may be of any of a variety of one or more types includingany one or more of a touchscreen, a button, an electrode, an externalcontroller, rows of electrodes, columns of electrodes, a matrix ofbuttons, an array of buttons, and/or any other configuration by whichinteraction with the touch sensor may be performed. With respect to thevarious embodiments, implementations, etc. of various respective touchsensors as described herein, note that they may also be of any suchvariety of one or more types. The one or more touch sensors 1910 areimplemented to detect user interaction based on user touch (e.g., viacapacitive coupling (CC) from a user to the one or more touch sensors1910).

At the top of the diagram, a user is associated with a seat in thevehicle and/or a drive-sense circuit interfaces (DSC I/F). A seat and/orDSC I/F is implemented to couple a signal via the user that is detectedby the one or more touch sensors 1910. Examples of such DSC I/F includeany means by which a signal may be coupled via a user. Examples of a DSCI/F include one or more of a pen, a conductive mat, a seat, a seat belt,a cell phone, a smart phone, a key fob, a watch, an active wrist-band, apersonal digital assistant (PDA), or a clip-on element as describedpreviously. In the context of the vehicle, any element within thevehicle that may be associated with a user may alternatively serve as aDSC I/F. For example, a seat within a vehicle may include various typesof wiring, electronics, heating elements, cooling elements, actuatorsfor seats positioning, a seatbelt, passenger/driver detectionfunctionality, etc. Any such elements associated with the seat of thevehicle may serve as a DSC I/F. In an example of operation andimplementation, a DSC is configured to transmit a signal via the DSCI/F, via a user, such that the signal is used to detect user interactionbased on user touch (e.g., via capacitive coupling (CC) from a user tothe one or more touch sensors 1910).

In some examples, note that the DSC I/F includes a DSC 28 therein (e.g.,a DSC I/F includes a DSC 28 therein that is configured to transmit asignal via a user that is detected by the one or more touch sensors1910). In general, a DSC I/F may be viewed as any element, component,etc. that is configured to couple a signal via a user that is detectedby the one or more touch sensors 1910. In some examples, such couplingis via capacitive coupling (CC) from the DSC I/F to the user.

At the bottom of the diagram, one or more processing modules 1930 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 1930 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 1930.A first group of one or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 1910.

In addition, a first DSC 28 is implemented to drive and simultaneouslyto sense a first user signal to seat and/or DSC I/F. The seat and/or DSCI/F is associated with the user #1. In this diagram, only a singleDSC/first DSC 28 is configured to couple a signal via a user via seatand/or DSC I/F to detect user interaction based on user touch (e.g., viacapacitive coupling (CC) from the user to the one or more touch sensors1910).

In an example of operation and implementation, the user interacts withthe one or more touch sensors 1910 when being associated with seatand/or DSC I/F. When doing so, a first DSC 28 transmits a first usersignal via DSC I/F that is capacitively coupled via capacitive coupling(CC) via the user to the one or more touch sensors 1910. The one or moreprocessing modules 1930 is configured to detect the first user signalvia one or more of the DSCs 28 that are coupled between the one or moreprocessing modules 1930 and the one or more touch sensors 1910. The oneor more processing modules 1930 is configured to discriminate the firstuser signal from the respective signals that are driven from the one ormore of the DSCs 28 that are coupled between the one or more processingmodules 1930 and the one or more touch sensors 1910. The one or moreprocessing modules 1930 is configured to identify not only theinteraction of a user with the one or more touch sensors 1910, but alsoconfigured to identify the user (e.g., and which DSC I/F associated withwhich respective user) is interacting with the one or more touch sensors1910.

In automotive touch screen applications (e.g., such as with respect toFIG. 18 and/or FIG. 19), some features of the one or more touch sensorsare disabled when the vehicle is in motion. This is a safety measuredeigned to prevent driver distraction. The unique identification ofusers as described herein, e.g., the driver of the vehicle, allows forthe discrimination of the driver from the passenger so that thepassenger can interact with the one or more touch sensors while thevehicle is in motion while the driver cannot interact with the one ormore touch sensor. This allows for the passenger to continue to interactwith the one or more touch sensors while the driver is not permitted todo so.

Note that there may be some situations in which only identification ofthe driver is desirable (e.g., such as in FIG. 19). For example, theremay be instances in which any user besides the driver of the vehicle isauthorized to interact with the one or more touch sensors (e.g., whilevehicle is in motion). However, such functionality may be included sothat unique identification of each of the respective users within thevehicle is made (e.g., the driver, one or more passengers, etc.).

In an example of operation and implementation, a DSC 28 is configured todrive the signal that is transmitted via capacitive coupling (CC) to auser (e.g., the driver). Such capacitive coupling (CC) to the user maybe implemented via any number of means including those described above.Note that the signal from the DSC 28 may operate at a unique frequency(or multiple frequencies independently or simultaneously). The frequencycan hop on a pre-arranged pattern or a handshake may be established witha one or more processing modules 1930, and the DSC is directed by theone or more processing modules 1930 which frequency to use.

In some examples, the signal transmitted from the DSC 28 that is coupledvia the user includes an Identifier (ID) code that is also broadcastproviding multi-factor disambiguation. In certain examples, the DSC 28is powered by an electronics power supply already in the seat of thevehicle (e.g., passenger detect, heated seats, power controls, etc.) Forpower efficiency, the broadcasting driver can be turned on (or evencycled only when there is a driver/passenger detected in thecorresponding seat). The capacitive coupling (CC) coupling can be donethrough conductive fibers in the seat, a conductive pad inside the seator any other means by which capacitively coupling (CC) couple via theuser may be performed.

Also, in some examples, capacitive sensors in the driver and passengerseats are employed in a feedback loop to the one or more processingmodules 1930. These sensors can be connected to the same one or moreprocessing modules 1930 that is driving the on-board one or more touchsensors 1910. Initially, for power management, the seat sensors could bein a low power (or disconnected) state. When a user interacts with theone or more touch sensors 1910, the one or more processing modules 1930activates the sensors in the seats using a unique frequency for thedriver and passenger. If the touch on the one or more touch sensors 1910is registered using the driver-assigned frequency, the one or moreprocessing modules 1930 will not respond with a touch activation. If thetouch is registered using the passenger frequency, touch events arereported by the one or more processing modules 1930. If both frequenciesare registered, the touch one or more processing modules 1930 would notrespond.

Note that there are many variations to such unique user identificationtechniques. In addition, as described in certain of the followingdiagrams, additional functionality may be included to identify one ormore users uniquely alternatively to or in conjunction with the uniquesignaling being coupled via a user including detection of a userhovering over the one or more touch sensors, detection of the angle ofapproach by which a user is approaching the one or more touch sensors,etc.

FIG. 20 is a schematic block diagram of an embodiment 2000 of a useridentification capable touch sensor in accordance with the presentinvention. A touch sensor system includes one or more touch sensors2010. The one or more touch sensors 2010 may be of any of a variety ofone or more types including any one or more of a touchscreen, a button,an electrode, an external controller, rows of electrodes, columns ofelectrodes, a matrix of buttons, an array of buttons, and/or any otherconfiguration by which interaction with the touch sensor may beperformed. With respect to the various embodiments, implementations,etc. of various respective touch sensors as described herein, note thatthey may also be of any such variety of one or more types. The one ormore touch sensors 2010 are implemented to detect user interaction basedon user touch (e.g., via capacitive coupling (CC) from a user to the oneor more touch sensors 2010).

In addition, the one or more touch sensors 2010 is configured to detectthe presence of the user before physically touching the one or moretouch sensors 2010. For example, as a user is initiating interactionwith the one or more touch sensors 2010, the one or more touch sensors2010 is configured to detect the existence of the user proximity to thetouchscreen. For example, considering a three-dimensional space, XYZ,where X and Y are the horizontal and vertical axes in the diagram and Zis the axis extending out of and into the diagram, as a user isapproaching the one or more touch sensors 2010, the one or more touchsensors 2010 is configured to detect the existence and location of theuser in that process.

As described with respect to other diagrams, one or more processingmodules is coupled to drive-sense circuits (DSCs) 28. Note that the oneor more processing modules may include integrated memory and/or becoupled to other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules. Afirst group of one or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 2010.

In some examples, the one or more processing modules determines orreceives information corresponding to one or more known locations of oneor more users with respect to the one or more touch sensors 2010 (e.g.,which may be known beforehand, predetermined, determined based ondetection of the one or more users, etc.). In such situations, the oneor more processing modules is configured to use the informationcorresponding to the one or more known locations of the one or moreusers in accordance with determining the angle of approach of the one ormore users to the one or more touch sensors 2010.

Considering a user depicted on the left-hand side of the diagram, atdifferent respective and successive times 1, 2, 3, as the user isapproaching the one or more touch sensors 2010, the one or moreprocessing modules is configured to determine the position of the userwith respect to the three-dimensional space, XYZ, in reference to theone or more touch sensors 2010. For example, the one or more processingmodules is configured to determine the position of the user at time 1and subsequently a different position of the user at time 2. The one ormore touch sensors modules than estimates the angle of approach of theuser to the one or more touch sensors 2010 based on these two positions.

In addition, the one or more processing modules is configured to performcomparison of a first angle of approach of first user interaction with asecond angle of approach of second user interaction to determine whichrespective user is initiating interaction with the one or more touchsensors 2010.

FIG. 21 is a schematic block diagram of another embodiment 2100 of auser identification capable touch sensor in accordance with the presentinvention. This diagram shows the one or more touch sensors 2010 isincluding a flat surface. Note that the angle of approach may bedetermined based on with respect to normal of the surface of one or moretouch sensors 2010 for the actual surface of one or more touch sensors2010 themselves. Alternatively, the angle of approach may be determinedbased on three-dimensional vector extending from the surface of the oneor more touch sensors 2010.

In an example, in the three-dimensional space, XYZ, consider that theposition of the user time 1 is estimated to be (X1, Y1, Z1), and thatthe that the position of the user time 2 is estimated to be (X2, Y2,Z2), then the angle of approach of the user initiating interaction withthe one or more touch sensors 2010 is based on a vector extending fromthe one or more touch sensors 2010 as defined by ([X2−X1], [Y2−Y1]),[Z2−Z1]).

In a specific example, in the three-dimensional space, XYZ, considerthat the position of the user time 1 is estimated to be (1, 1, 5), andthat the that the position of the user time 2 is estimated to be (5, 5,1), then the angle of approach of the user initiating interaction withthe one or more touch sensors 2010 is based on a vector extending fromthe one or more touch sensors 2010 as defined by ([X2−X1], [Y2−Y1]),[Z2−Z1])=([1−5], [1−5]), [5−1])=(−4,−4,4). In this specific example, theone or more processing modules is configured to determine that thisangle of approach is associated with a user located approximately to theleft-hand side or left-hand portion of the one or more touch sensors2010.

Alternatively, if the angle approach corresponded to a three-dimensionalvector extending from the right-hand side or right hand portion of theone or more touch sensors 2010, then the one or more processing modulesthat this angle of approach is associated with a user locatedapproximately to the right-hand side or right-hand portion of the one ormore touch sensors 2010.

In an example of operation and implementation, consider that the one ormore touch sensors 2010 are implemented within the vehicle that includesthe driver's seat on the left-hand side of the one or more touch sensors2010. When the angle of approach of the user to the one or more touchsensors 2010 is determined to be from the left-hand side or left-handportion of the one or more touch sensors 2010, then the one or moreprocessing modules determines that such user interaction is associatedwith the driver. Alternatively, when the angle of approach of the userto the one or more touch sensors 2010 is determined to be from theright-hand side or right-hand portion of the one or more touch sensors2010, then the one or more processing modules determines that such userinteraction is associated with another passenger in the vehicle who isnot the driver.

FIG. 22 is a schematic block diagram of an embodiment of a method 2200for execution by one or more devices in accordance with the presentinvention. The method 2200 operates in step 2210 by transmitting a firstsignal via a first element associated with a first user. The firstsignal includes one or more characteristics that allow for uniqueidentification of the first user. The method 2200 also operates in step2220 by transmitting a second signal via a second element associatedwith a second user. The second signal includes one or morecharacteristics that allow for unique identification of the second user.

The method 2200 operates in step 2230 by detecting user interaction withone or more touch sensors. Note that the operations within the steps2210, 2220, and 2230 may be performed using one or more DSCs that areconfigured to perform simultaneous transmit and receive via a singleline (e.g., simultaneous drive and detect via a single line).

The method 2200 operates in step 2240 by determining whether userinteraction with the one or more touch sensors compares favorably withauthorization. In some examples, the determination is made whether ornot the user interaction is associated with second user and not thefirst user.

Based on a determination that the user interaction with the one or moretouch sensors compares favorably with authorization, the method 2200operates via step 2250 and step 2270 by permitting them processing theuser interaction with the one or more touch sensors. In some examples,this involves execution of one or more operations associated with theuser interaction with the one or more touch sensors. Such one or moreoperations may be associated with any one or more functions that aredirected or controlled via the user interaction with the one or moretouch sensors.

Alternatively, based on a determination that the user interaction withthe one or more touch sensors compares unfavorably with authorization,the method 2200 operates via step 2250 and step 2260 blocking the userinteraction with the one or more touch sensors. In some examples, thisinvolves failing to execute or aborting execution of the one or moreoperations associated with the user interaction with the one or moretouch sensors. In even other examples, this involves discarding the userinteraction with the one or more touch sensors.

FIG. 23 is a schematic block diagram of another embodiment of a method2300 for execution by one or more devices in accordance with the presentinvention. The method 2300 operates in step 2302 by operating one ormore drive-sense circuits (DSCs) associated with one or more users andlow-power mode. Such low-power mode may include one or more of reducedpower, lower power, off, etc.

The method 2300 operates in step 2304 by monitoring for user interactionwith one or more touch sensors. Based on failure to detect userinteraction with the one or more touch sensors in step 2306, the method2300 loops back to step 2302.

Based on detection of user interaction with the one or more touchsensors in step 2310, the method 2300 operates in step 2310 bytransmitting a first signal via a first element associated with a firstuser. The first signal includes one or more characteristics that allowfor unique identification of the first user. The method 2300 alsooperates in step 2320 by transmitting a second signal via a secondelement associated with a second user. The second signal includes one ormore characteristics that allow for unique identification of the seconduser.

Note that the operations within the steps 2302, 2304, 2306, 2310, and2320 may be performed using one or more DSCs that are configured toperform simultaneous transmit and receive via a single line (e.g.,simultaneous drive and detect via a single line).

The method 2300 operates in step 2340 by determining whether userinteraction with the one or more touch sensors compares favorably withauthorization. In some examples, the determination is made whether ornot the user interaction is associated with second user and not thefirst user.

Based on a determination that the user interaction with the one or moretouch sensors compares favorably with authorization, the method 2300operates via step 2350 and step 2370 by permitting them processing theuser interaction with the one or more touch sensors. In some examples,this involves execution of one or more operations associated with theuser interaction with the one or more touch sensors. Such one or moreoperations may be associated with any one or more functions that aredirected or controlled via the user interaction with the one or moretouch sensors.

Alternatively, based on a determination that the user interaction withthe one or more touch sensors compares unfavorably with authorization,the method 2300 operates via step 2350 and step 2360 blocking the userinteraction with the one or more touch sensors. In some examples, thisinvolves failing to execute or aborting execution of the one or moreoperations associated with the user interaction with the one or moretouch sensors. In even other examples, this involves discarding the userinteraction with the one or more touch sensors.

FIG. 24 is a schematic block diagram of an embodiment 2400 of a portionof a touch sensor that includes two touch sensors in accordance with thepresent invention. This diagram shows the first touch sensor thatincludes electrodes that are arranged in a first set of rows and a firstof columns. In addition, the diagram shows a second set touch sensorthat includes electrodes that are arranged in a second set of rows and asecond set of columns. For example, the first touch sensor includes rowsidentified as row 1, sys. 1 (row 1, system 1), row 2, sys. 1 (row 2,system 1), and columns identified as col 1, sys. 1 (col 1, system 1),col 2, sys. 1 (col 2, system 1). The second touch sensor includes rowsidentified as row 1, sys. 2 (row 1, system 2), row 2, sys. 2 (row 2,system 2), and columns identified as col 1, sys. 2 (col 1, system 2),col 2, sys. 2 (col 2, system 2).

In this diagram as well as other examples in embodiments includedherein, note that while the configuration of the respective touchsensors (e.g., two touch sensors in this particular diagram) are shownin a row and column format, in general, the configuration of a touchsensor including respective electrodes that are implemented and two weremore touch sensors may be arranged in any desired configuration inaccordance with any desired pattern (e.g., Manhattan pattern, diamondpattern, and/or any other desired configuration in accordance with anydesired pattern). In addition, note that land multiple respective touchsensors are implemented, any two were more of them may be implemented indifferent configurations in accordance with different patterns. Forexample, at first touch sensor may be implemented in accordance with aManhattan pattern, while a second touch sensor may be implemented inaccordance with a diamond pattern. In general, different respectivetouch sensors implemented within the system including two or more touchsensors may be independently implemented in accordance with any desirednumber of configurations in accordance with any desired number ofdesired patterns.

In addition, note that the two or more touch sensors 1410 may be of anyof a variety of one or more types including rows of electrodes, columnsof electrodes, a matrix of buttons, an array of buttons, and/or anyother configuration by which interaction with the touch sensor may beperformed. With respect to the various embodiments, implementations,etc. of various respective touch sensors as described herein, note thatthey may also be of any such variety of one or more types.

In an example of operation and implementation, the two respective touchsensors operate independently of one another, such that one of the touchsensors is redundant to the other. In another example of operation andimplementation, the two respective time sensors operate cooperativelywith respect one another such that their operation is cooperative andmay transition in and out of different perspective modes of operationincluding those in which they both operate simultaneously, in which onlyone of them is operating at a time, in which one of them is operating toverify the operation of the other, in which there is operation inaccordance with one or more power management considerations, and/orother modes of operation.

In some examples as described herein, a single Procap sensor isconnected to two independent and redundant touch systems consisting ofall electronics, power supply, connectors, etc. Although two systemsprovide redundancy, this can be extended to n systems, where n is apositive integer greater than or equal to 3. In this diagramparticularly, with respect to one possible example, a single Procapsensor, showing a Manhattan pattern, is divided up into to tworespective touch sensors. By taking every other row and column to beused, respectively as the first and second touch sensors. Each sectionis connected to an independent touch system. Each touch system can alsocommunicate with each other if desired in some embodiments.

Many advantages are provided by constructing an overall touch system inthis manner. For example, in one implementation, it uses the sametechnology for both sensor systems. This can provide for lower cost thancombining two complete systems of dissimilar technologies. It canoperate in hi-resolution mode with both touch systems operating. Inaddition, it is fully functional in a lower resolution mode if one ofthe touch systems fails (e.g., in a failure mode, the operation can beautomatically adapted for optimal operation at reduced resolution). Itcan be operated in a single touch sensor mode for power savings. Also, asingle touch sensor provides a low profile of a true zero-height profilefor in-cell systems (e.g., in accordance with a redundant touch in anin-cell implementation). The two touch systems can query each other toverify full functionality and report deviations from that expectation.Also, it can be constructed using a wide variety of single andmulti-layer materials depending on cost, ergonomic, environmental orindustrial design requirements. Also, in a failure situation withrespect to one or more of the touch sensors, the working system can“call home” and a replacement unit can be sent to the customer withoutthe customer even knowing that one system is down.

FIG. 25 is a schematic block diagram of an embodiment 2500 of a touchsensor that includes three touch sensors in accordance with the presentinvention. This diagram shows three respective touch sensors that eachrespectively include electrodes that are arranged in respective sets ofrows and columns. For example, the first touch sensor includes rowsidentified as row 1, sys. 1 (row 1, system 1), row 2, sys. 1 (row 2,system 1), and columns identified as col 1, sys. 1 (col 1, system 1),col 2, sys. 1 (col 2, system 1). The second touch sensor includes rowsidentified as row 1, sys. 2 (row 1, system 2), row 2, sys. 2 (row 2,system 2), and columns identified as col 1, sys. 2 (col 1, system 2),col 2, sys. 2 (col 2, system 2). The third touch sensor includes rowsidentified as row 1, sys. 3 (row 1, system 3), row 2, sys. 3 (row 2,system 3), and columns identified as col 1, sys. 3 (col 1, system 3),col 2, sys. 3 (col 2, system 3).

In an example of operation and implementation, the three respectivetouch sensors operate independently of one another. For example, thefirst touch sensor operates primarily, and the two other touch sensorsoperate redundantly to the first touch sensor. In another example ofoperation and implementation, the three respective time sensors operatecooperatively with respect one another such that their operation iscooperative and may transition in and out of different perspective modesof operation including those in which they both operate simultaneously,in which only one of them is operating at a time, in which one of themis operating to verify the operation of the other, in which there isoperation in accordance with one or more power managementconsiderations, and/or other modes of operation.

FIG. 26 is a schematic block diagram of an embodiment 2600 of a thatincludes n touch sensors in accordance with the present invention, wheren is a positive integer greater than or equal to 3. This diagram shows n(where n is a positive integer greater than or equal to 3) respectivetouch sensors that each respectively include electrodes that arearranged in respective sets of rows and columns. For example, the firsttouch sensor includes rows identified as row 1, sys. 1 (row 1, system1), row 2, sys. 1 (row 2, system 1), and columns identified as col 1,sys. 1 (col 1, system 1), col 2, sys. 1 (col 2, system 1). The secondtouch sensor includes rows identified as row 1, sys. 2 (row 1, system2), row 2, sys. 2 (row 2, system 2), and columns identified as col 1,sys. 2 (col 1, system 2), col 2, sys. 2 (col 2, system 2). The nth touchsensor includes rows identified as row 1, sys. n (row 1, system n), row2, sys. n (row 2, system n), and columns identified as col 1, sys. n(col 1, system n), col 2, sys. n (col 2, system n). In general, anydesired number of touch sensors may be implemented within a givendevice.

FIG. 27 is a schematic block diagram of an embodiment 2700 of a touchsensor system in accordance with the present invention. In this diagram,on the lower right-hand side, a cross-section of two or more touchsensors is shown. In general, note that any desired number of touchsensors may be implemented. A number of DSCs are implemented to driveand simultaneously to sense signals via the respective electrodes of therespective touch sensors. For example, a first group of DSCs areimplemented to drive and simultaneously to sense signals via therespective electrodes of the first touch sensor. A second group of DSCsare implemented to drive and simultaneously to sense signals via therespective electrodes of the second touch sensor.

In this diagram, different respective processing modules are implementedfor the respective touch sensors. Also, with respect to the one or moreprocessing modules included in this diagram and/or any other diagramherein, note that the one or more processing modules 1430 may includeintegrated memory and/or be coupled to other memory. At least some ofthe memory stores operational instructions to be executed by the one ormore processing modules.

For example, for the first touch sensor, referenced as system 1, one ormore processing modules 2710 is coupled to the first group of DSCs thatare implemented to drive and simultaneously to sense signals via therespective electrodes of the first touch sensor. Similarly, for thesecond touch sensor, referenced as system 2, one or more processingmodules 2720 is coupled to the second group of DSCs that are implementedto drive and simultaneously to sense signals via the respectiveelectrodes of the second touch sensor. When more than two respectivetouch sensors are implemented, for the nth touch sensor, referenced assystem n, one or more processing modules 2730 is coupled to the nthgroup of DSCs that are implemented to drive and simultaneously to sensesignals via the respective electrodes of the nth touch sensor.

If desired in certain embodiments, one or more switching networks 2740are implemented to allow selective coupling of the respective groups ofDSCs to the respective electrodes of the respective touch sensors. Inaddition, with respect to a single touch sensor, note that differentrespective subsets of the electrodes therein may be operated atdifferent respective times.

In an example of operation and implementation, considering the system 1,the one or more processing modules 2710 is configured via the one ormore switching networks 2740 to drive and simultaneously to sensesignals via different respective subsets of the electrodes of the firsttouch sensor. For example, any particular example, only the every Xthrow electrode and only the every Yth column electrode (where X and Y arerespective positive integers greater than or equal to 2) are operationalat a given time. Then, have a different time, only the every Ath rowelectrode and only the every Bth column electrode (where A and B arerespective positive integers greater than or equal to 2) areoperational. In general, different respective modes of operation thatuse different respective subsets of the electrodes of the first touchsensor at different times. Similar operation may be performed withrespect to the second touch sensor and optionally any other touchsensors as well.

Also, the first touch sensor, the second touch sensor, and optionallyany additional touch sensors, may be implemented to operatecooperatively such that communication is performed between therespective one or more processing modules associated there with. Forexample, the one or more processing modules 2710 associated with thefirst touch sensor and the one or more processing modules 2720associated with the second touch sensor are in communication with oneanother via one or more communication paths. The respective one or moreprocessing modules 2710 and 2720 operate and coordinate the operation ofthe first touch sensor and the second touch sensor. In general, whenmore than two touch sensors are implemented, the respective one or moreprocessing modules associated with each of the respective touch sensorsmay operate cooperatively with one another to enter into and switchamong various modes of operation.

In certain of the subsequent diagrams, different respective touchsensors are sometimes referred to as different respective systems. Forexample, a first system corresponds to the electrodes, one or moreprocessing modules, one or more DSCs, etc. associated with a first touchsensor. A second system corresponds to the electrodes, one or moreprocessing modules, one or more DSCs, etc. associated with a secondtouch sensor.

FIG. 28 is a schematic block diagram of another embodiment 2800 of atouch sensor system in accordance with the present invention. Thisdiagram has some similarities to the previous diagram, with at least onedifference being that one or more processing modules 2810 is implementedto coordinate operation of the respective touch sensors (e.g.,associated with system 1, 2, and optionally up to n, where n is apositive integer greater than or equal to 3). Note that one or moreswitching networks 2840 may optionally be implemented to allowselectivity (e.g., in cooperation with and/or via direction orinstruction from the one or more processing modules 2010) regardingwhich respective touch sensors are operational at any given time, theoperational mode by which any one or more of the touch sensors isoperational at a given time, which respective electrodes of any one ormore of the touch sensors is operational at a given time, etc.

FIG. 29A is a schematic block diagram of another embodiment of a method2900 for execution by one or more devices in accordance with the presentinvention. The method 2900 operates by operating a first system in step2910. The method 2900 operates by operating a second system in step2920. Note that the second system may be operated redundantly to oralternatively to the first system. In certain embodiments, a method 2900also operates by operating an nth system in step 2930, where n is apositive integer greater than or equal to 3. Note that the nth systemmay be operated redundantly to or alternatively to the first and/orsecond systems.

In addition, note that the operations of the steps 2910 and 2920 may beoperated independently with respect one another and/or simultaneously.In some examples, note that the operations of the steps 2910, 2920, and2930 may be operated independently with respect one another and/orsimultaneously.

FIG. 29B is a schematic block diagram of another embodiment of a method3000 for execution by one or more devices in accordance with the presentinvention. The method 2901 operates by operating a first system in step2911. The method 2901 operates by operating a second system in step 2921cooperatively with the first system. In certain embodiments, a method2901 also operates by operating an nth system in step 2931, where n is apositive integer greater than or equal to 3, cooperatively with thefirst and second systems.

In this embodiment, when operating only the first system, the overalltouch system operates based on a first resolution. When operating usingboth the first and second systems, the overall touch system operatesbased on a second resolution that is different than the firstresolution. When operating using the first, second, and up to the nthsystems, the overall touch system operates based on an nth resolutionthat is different than the first resolution and the second resolution.In addition, note that different respective granularity is within eachrespective first, second, etc. resolutions may be performed by operatingdifferent respective subsets of the electrodes associated with thedifferent respective systems.

FIG. 30A is a schematic block diagram of another embodiment of a method3000 for execution by one or more devices in accordance with the presentinvention. The method 3000 operates in step 3010 by operating based onthe first system. The method 3000 operates in step 3020 by performingdiagnostics on a second system.

In one example, when no failure is detected in step 3030, the method3000 loops back to the step 3010. When one or more failures are detectedin step 3030, the method 3000 operates by performing one or morecorrective actions in step 3035. For example, various corrective actionsmay include in one or more of modifying the operational mode of theoverall touch system, providing an error message, communicating failureof at least one aspect of at least one of the systems, requesting areplacement unit to be provided from a manufacturer and/or serviceprovider, notifying a user, notifying the service provider, etc. Ingeneral, any number of different respective corrective actions may beperformed when one or more failures is detected based on performingdiagnostics on the second system in step 3020. When possible, one ormore corrective actions includes an automated process that attempts tomitigate or eliminate the error. For example, one possible correctiveaction may be to perform a power cycle of the for which one or morefailures has been detected.

In another example, when no failure is detected in step 3030, the method3000 operates by operating based on the second system in step 3040. Themethod 3000 operates in step 3050 by performing diagnostics on the firstsystem.

In one example, when no failure is detected in step 3060, the method3000 loops back to the step 3010 or 3040. When one or more failures aredetected in step 3060, the method 3000 operates by performing one ormore corrective actions in step 3065. For example, various correctiveactions may include in one or more of modifying the operational mode ofthe overall touch system, providing an error message, communicatingfailure of at least one aspect of at least one of the systems,requesting a replacement unit to be provided from a manufacturer and/orservice provider, notifying a user, notifying the service provider, etc.In general, any number of different respective corrective actions may beperformed when one or more failures is detected based on performingdiagnostics on the first system in step 3050. When possible, one or morecorrective actions includes an automated process that attempts tomitigate or eliminate the error. For example, one possible correctiveaction may be to perform a power cycle of the for which one or morefailures has been detected.

In another example, when no failure is detected in step 3060, the method3000 operates in step 3070 by operating using a fail-free or stilloperable system (e.g., the first and/or second system).

FIG. 30B is a schematic block diagram of another embodiment of a method3001 for execution by one or more devices in accordance with the presentinvention. The method 3001 operates in step 3011 by operating a firstsystem. The method 3001 operates in step 3021 by operating a secondsystem. The operation of the second systems may be performed redundantlyto or cooperatively with the first system. The method 3001 operates instep 3030 by performing diagnostics on the first and/or second system.

When no failure is detected based on the first system and/or the secondsystem in step 3041, the method 3001 loops back to performing theoperations within one or more of the steps 3011, 3021, and/or 3031. Whenone or more failures is detected based on the first system and/or thesecond system in step 3041, the method 3001 operates by performing oneor more corrective actions. Some examples of such corrective actions aredescribed above. In certain examples, the method 3001 operates in step3061 by operating using a fail-free or still operable system (e.g., thefirst and/or second system).

FIG. 31 is a schematic block diagram of another embodiment of a method3100 for execution by one or more devices in accordance with the presentinvention. The method 3100 operates in step 3110 by operating firstsystem. The method 3100 operates in step 3120 by operating a secondsystem. The method 3100 operates in step 3120 by operating a secondsystem. The operation of the second systems may be performed redundantlyto or cooperatively with the first system. The method 3100 operates instep 3010 by monitoring for one or more conditions warranting a powersaving operational mode. Examples of one or more conditions warranting apower saving operational mode may include reduced battery life orbattery life below a particular threshold, disconnection from AC power,one or more of the systems consuming energy at a rate or level thatexceeds a particular threshold, reduced performance of one or more ofthe systems, and/or any other consideration.

When no condition warranting a power savings operational mode aredetected in step 3140, the method 3100 loops back to perform theoperations within one or more of the steps 3110, 3120, and 3130.

Alternatively, when one or more conditions warranting a power savingsoperational mode are detected in step 3140, the method 3100 operates instep 3150 by operating in a power saving operational mode. Examples ofthe power saving operational mode may include operating in accordancewith a reduced power, operating using fewer than all of the systemsavailable within the overall touch sensor, operating using fewer thanall of the electrodes within a given system, operating using only thefirst system or the second system but not both, etc.

The method 3100 also operates in step 3160 by monitoring for one or moreconditions permitting exit from the power saving operational mode.Examples of one or more conditions warranting an exit from the powersaving operational mode may include increased battery life or batterylife above a particular threshold, connection or detection ofreconnection to AC power, one or more of the systems consuming energy ata rate or level that is below a particular threshold, acceptableperformance of performance of one or more of the systems, and/or anyother consideration.

When one or more conditions warranting an exit from the power savingsoperational mode are detected in step 3170, the method 3100 loops backto perform the operations within one or more of the steps 3110, 3120,and 3130. Alternatively, when no condition warranting a power savingsoperational mode are detected in step 3170, the method 3100 operates viastep 3170 by continuing operating in the power saving operational modein step 3150. Alternatively, when no condition warranting a powersavings operational mode are detected in step 3170, the method 3100operates via step 3170 by ending.

And certain touch sensor applications, it may be desirable to have oneor more redundant touch systems. For example, in certain applicationareas including aviation, automotive, industrial, medical, maritime,etc., one or more redundant systems provides continued operation of theoverall system even in the event of failure of one or more of thesystems. In certain applications, having one or more redundant systemscan provide for failsafe for nearly failsafe operation.

In some examples redundant systems can be constructed by combiningindependent systems of different touch technologies. Various examples oftouch sensor technologies include one or more of Analog Resistive,infrared (IR) and Camera Optical, Surface Acoustic Wave, Ultrasound,Projected Capacitive, etc. In some examples, each of the respectivesystems includes its own respective power supply. In other examples, twoor more of the respective systems operate using a common power supply.

Within some applications, it may be prohibitively costly and undesirableto have independent respective power supplies for each of the respectivesystems for any number of reasons (e.g., ergonomic, industrial design,or electrical reasons). As described herein with respect to certainexamples of embodiments, a single Procap (projected-capacitive) sensor,which may be implemented to include both single layer and multi-layer,can be operated by two or more independent touch controllers (e.g.,based on one or more processing modules and different respective groupsof DSCs, one or more switching networks, and/or other components asdescribed herein).

In certain implementations, a more or most likely point of failurewithin the overall touch sensor system is not the one or more sensorsthemselves (e.g., a touchscreen, the electrodes of the respective touchsensors, etc.), which are typically very robust both mechanically andelectrically, but a more or most likely point of failure within theoverall touch sensor system is the surrounding electronics, connectors,power supply, etc. as described herein, having cost-effective redundantsystems for the higher-probability failure points is both desirable andrealistic. This is a very flexible system that contains many advantages,embodiments, configurations, etc.

FIG. 32 is a schematic block diagram of an embodiment 3200 of a vehicleimplemented with user-interactive glass feature in accordance with thepresent invention. A touch sensor system includes one or more touchsensors 3210. The one or more touch sensors 3210 may be of any of avariety of one or more types including any one or more of a touchscreen,a button, an electrode, an external controller, rows of electrodes,columns of electrodes, a matrix of buttons, an array of buttons, a filmthat includes any desired implementation of components to facilitatetouch sensor operation, and/or any other configuration by whichinteraction with the touch sensor may be performed. With respect to thevarious embodiments, implementations, etc. of various respective touchsensors as described herein, note that they may also be of any suchvariety of one or more types.

At the bottom left of the diagram, one or more processing modules 3230is coupled to one or more drive-sense circuits (DSCs) 28. Note that theone or more processing modules 3230 may include integrated memory and/orbe coupled to other memory. At least some of the memory storesoperational instructions to be executed by the one or more processingmodules 3230. One or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 3210.

In this diagram, the one or more touch sensors 3210 are included withinone or more vehicle windows. In general, the one or more touch sensors3210 may be included in any glass feature within the vehicle. The one ormore processing modules 3230 is also configured to facilitate executionof one or more operations associated with the vehicle. Some examples ofsuch operations include operation of a window motor 3240, operation ofwindow tint controller 3242, operation of windshield wipers 3244,operation of side and/or rearview mirror controller 3244, and/or anyother functions 3249. Note that the coupling between the one or moreprocessing modules 3230 and the various respective operations associatedwith the vehicle may also be made using one or more DSCs 28. Forexample, the interaction and operation between one or more processingmodules 3230 and the various components implemented within the vehicleto execute such operations may be made via one or more DSCs 28.

In an example of operation and implementation, a user within thevehicle, such as a vehicle passenger sitting in a vehicle seat,interacts with the one or more touch sensors 3210 implemented within avehicle window. The motion and/or touch on the window is detected andinterpreted by the one or more processing modules 3230 in accordancewith facilitating the execution of the motion and/or touch on thewindow. Note also that different respective motions and/or touches maycorrespond to different respective operations. In general, differentrespective motions and/or touches may correspond to different respectivecommands provided from a user to direct operation of one or morecomponents, systems, modules, etc. of the vehicle. Some examples of suchmotions and/or touches on the window are described in the table in thelower right-hand portion of the diagram. In general, any desired mappingof different respective motions and/or touches may be assigned to anydesired commands for action to be performed by one or more components,systems, modules, etc. of the vehicle. The examples provided are not anexhaustive list, and in general, and any operations associated with thevehicle may be assigned to any desired motions and/or touches. Ingeneral, a motion x may be assigned for a command for action to performan action x; similarly, a touch location a may be assigned for a commandfor action to perform an action z; where x and a are assignable,reconfigurable, programmable, etc.

FIG. 33 is a schematic block diagram of an embodiment 3300 of a showerstall implemented with user-interactive glass feature in accordance withthe present invention. A touch sensor system includes one or more touchsensors 3310. Note that the one or more touch sensors 3310 may beimplemented and integrated within the glass of the shower stall.Alternatively, the one or more touch sensors 3310 may be implementedwithin one or more films that is/are located on the inside and/or theoutside of the shower stall. The one or more touch sensors 3310 may beof any of a variety of one or more types including any one or more of atouchscreen, a button, an electrode, an external controller, rows ofelectrodes, columns of electrodes, a matrix of buttons, an array ofbuttons, a film that includes any desired implementation of componentsto facilitate touch sensor operation, and/or any other configuration bywhich interaction with the touch sensor may be performed. With respectto the various embodiments, implementations, etc. of various respectivetouch sensors as described herein, note that they may also be of anysuch variety of one or more types.

In addition, note that the one or more touch sensors 3310 may beimplemented within nontransparent or opaque portions of the showerstall. For example, the one or more touch sensors 3310 need not beimplement within clear or transparent glass. The one or more touchsensors 3310 may be implemented within tile, travertine, knobs, watercontrollers, etc. and/or any other surface and/or component accessibleto user within the shower stall.

At the bottom left of the diagram, one or more processing modules 3330is coupled to one or more drive-sense circuits (DSCs) 28. Note that theone or more processing modules 3330 may include integrated memory and/orbe coupled to other memory. At least some of the memory storesoperational instructions to be executed by the one or more processingmodules 3330. One or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 3310.

In this diagram, the one or more touch sensors 3310 are included withinone or more features within a shower glass and/or door. In general, theone or more touch sensors 3310 may be included in any glass featurewithin a home, building, place of business, etc. The one or moreprocessing modules 3330 is also configured to facilitate execution ofone or more operations associated with the environment in which the oneor more touch sensors 3310 are implemented. Some examples of suchoperations in the context of a shower may include operation of waterflow control 3340, water temperature control 3342, light control 3344such as turning the light on or off or adjusting its brightness/dimmingthe light, and/or any other function associated with the environment inwhich the one or more touch sensors 3310 are implemented. Note that thecoupling between the one or more processing modules 3330 and the variousrespective operations associated with the environment also may be madeusing one or more DSCs 28. For example, the interaction and operationbetween one or more processing modules 3330 and the various componentsassociated with the environment to execute such operations may be madevia one or more DSCs 28.

In an example of operation and implementation, a user within the showerinteracts with the one or more touch sensors 3210 implemented within theenvironment of the shower stall. The motion and/or touch on the one ormore touch sensors 3210 is detected and interpreted by the one or moreprocessing modules 3230 in accordance with facilitating the execution ofthe motion and/or touch on the one or more touch sensors 3210. Note alsothat different respective motions and/or touches may correspond todifferent respective operations. In general, different respectivemotions and/or touches may correspond to different respective commandsprovided from a user to direct operation of one or more components,systems, modules, etc. of the environment of the shower stall. Someexamples of such motions and/or touches on the window are described inthe table in the lower right-hand portion of the diagram. In general,any desired mapping of different respective motions and/or touches maybe assigned to any desired commands for action to be performed by one ormore components, systems, modules, etc. of the environment of the showerstall. The examples provided are not an exhaustive list, and in general,and any operations associated with the environment of the shower stallmay be assigned to any desired motions and/or touches. In general, amotion x may be assigned for a command for action to perform an actionx; similarly, a touch location a may be assigned for a command foraction to perform an action z; where x and a are assignable,reconfigurable, programmable, etc.

FIG. 34 is a schematic block diagram of an embodiment 3400 of auser-interactive glass feature implemented with one or more identifiersin accordance with the present invention. A touch sensor system includesone or more touch sensors 3410. Note that the one or more touch sensors3410 may be implemented and integrated within any type of elementincluding glass, mirror, etc. Note that the one or more touch sensors3410 may be implemented within one or more films that is/are located onthe inside and/or the outside of such an element including glass,mirror, etc. The one or more touch sensors 3410 may be of any of avariety of one or more types including any one or more of a touchscreen,a button, an electrode, an external controller, rows of electrodes,columns of electrodes, a matrix of buttons, an array of buttons, a filmthat includes any desired implementation of components to facilitatetouch sensor operation, and/or any other configuration by whichinteraction with the touch sensor may be performed. With respect to thevarious embodiments, implementations, etc. of various respective touchsensors as described herein, note that they may also be of any suchvariety of one or more types.

In addition, note that the one or more touch sensors 3410 may beimplemented within nontransparent or opaque portions of the elementincluding glass, mirror, etc. For example, the one or more touch sensors3410 need not be implement within clear or transparent glass.

At the bottom left of the diagram, one or more processing modules 3430is coupled to one or more drive-sense circuits (DSCs) 28. Note that theone or more processing modules 3430 may include integrated memory and/orbe coupled to other memory. At least some of the memory storesoperational instructions to be executed by the one or more processingmodules 3430. One or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 3410.

In an example of operation and implementation, the one or more touchsensors 3410 are associated with an element on which one or moreidentifiers are implemented. Again, the one or more touch sensors 3410may be implemented within the element in any of a number of waysincluded integrated therein, included in the film placed thereon, etc.For example, the element may include glass, mirror, a touchscreen, etc.The one or more identifiers may include printing, labeling, text,symbols, and/or any other indicators. The identifiers provide indicationto a user interacting with the one or more touch sensors 3410 of whereto interact in order to facilitate execution of one or more operations.For example, control for one or more elements associated with one ormore identifiers is shown with respect to 4 different portions of theone or more touch sensors 3410 on the middle and right hand side portionof the diagram.

In general, if any desired number of regions associated with differentrespective identifiers may be included within the element that isassociated with the one or more touch sensors 3410. In addition, anydesired number of sub-identifiers may be included with any one of theregions in which the element is partitioned. For example, considering asection 3 that includes the one or more identifiers 3, there may be anynumber of sub-sections included therein. In general, any desired levelof granularity, sub-division, etc. of the one or more identifiers, theone or more sub-identifiers, may be implemented with respect to theelement that is associated with the one or more touch sensors 3410.

Based upon user interaction with the one or more touch sensors 3410 andspecifically on the one or more identifiers associated with the one ormore touch sensors 3410, the one or more processing modules 3430facilitate execution of control of different respective operations. Forexample, interaction with the one or more identifiers 1 in the upperleft-hand portion of the element on which the one or more identifiersare implemented facilitates execution of control of operationsassociated therewith.

In an example of operation and implementation, consider that the one ormore identifiers 3 are associated with an audio system (e.g., such asmay be implemented within a home, a place of business, a place oflearning, etc.), The one or more sub-identifiers 3,1 through 3,4, etc.are associated with particular operations of the audio system that mayinclude any one or more of turning the system on or off, adjustingvolume, controlling which speakers are operational, controlling theequalizer operation of the audio system, and/or any other operationsassociated with the audio system.

In some examples, the use of identifiers and/or sub-identifiers mayfacilitate better user interaction with the one or more touch sensors3410. Also, in other examples the use of identifiers allows for specificmapping of one or more portions of the one or more elements associatedwith the one or more touch sensors 3410 to be specifically assigned andmapped for different operations.

Note that the coupling between the one or more processing modules 3430and the various respective functions associated with the identifiersalso may be made using one or more DSCs 28. For example, the interactionand operation between one or more processing modules 3430 and thevarious components associated with the identifiers to execute suchfunctions may be made via one or more DSCs 28.

The environments of application of such identifiers and/orsub-identifiers in conjunction with one or more touch sensors 3410 aremyriad. Considering just some examples within a home, various userinteractive operations may be implemented using one or more touchsensors 3410 that are associated with one or more elements andassociated identifiers and/or sub-identifiers may include any one ormore of thermostat controls, doorbells, light switches and/or controls,HVAC controls, security panels, door locking and/or unlocking, drivewaygate control, etc. Such examples are not exhaustive, and in general, anydesired user interaction with a control element may be implemented insuch a manner.

In general, any user interaction with a control element in any componentand/or surface may be implemented using such identifiers and/orsub-identifiers in conjunction with one or more touch sensors 3410 inconjunction with one or more elements.

FIG. 35 is a schematic block diagram of an embodiment 3500 of a steeringwheel implemented with a touch sensor in accordance with the presentinvention. A touch sensor system includes one or more touch sensors3510. In this diagram, the one or more touch sensors 3510 areimplemented within the steering wheel that is implemented within avehicle. Note that the one or more touch sensors 3510 may be implementedwithin one or more films that is/are located on the inside and/or theoutside of the steering wheel. The one or more touch sensors 3510 may beof any of a variety of one or more types including any one or more of atouchscreen, a button, an electrode, an external controller, rows ofelectrodes, columns of electrodes, a matrix of buttons, an array ofbuttons, a film that includes any desired implementation of componentsto facilitate touch sensor operation, and/or any other configuration bywhich interaction with the touch sensor may be performed. With respectto the various embodiments, implementations, etc. of various respectivetouch sensors as described herein, note that they may also be of anysuch variety of one or more types. In addition, note that the one ormore touch sensors 3510 may be implemented within nontransparent oropaque portions of the steering wheel.

At the bottom left of the diagram, one or more processing modules 3530is coupled to one or more drive-sense circuits (DSCs) 28. Note that theone or more processing modules 3530 may include integrated memory and/orbe coupled to other memory. At least some of the memory storesoperational instructions to be executed by the one or more processingmodules 3530. One or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 3510.

Based upon user interaction with the one or more touch sensors 3510associated with the steering wheel, the one or more processing modules3530 facilitate execution of control of different respective functionsassociated with the vehicle. Any number of different functions 1 throughn associated with the vehicle may be associated with user interactionwith the one or more touch sensors 3510.

Note that the coupling between the one or more processing modules 3530and the various respective functions associated with the vehicle alsomay be made using one or more DSCs 28. For example, the interaction andoperation between one or more processing modules 3530 and the variouscomponents associated with the vehicle to execute such functions may bemade via one or more DSCs 28.

In some examples, a heads-up display (HUD) 3550 is also implemented inthe vehicle. In some embodiments, a user interacts with the one or moretouch sensors 3510 that are associated with the steering wheel tointeract with the HUD 3550. The HUD 3550 provides a visualrepresentation of various respective operations associated with thevehicle. For example, any display related information that may beprovided via a display implemented within the vehicle, such as may beimplemented in the dashboard of the vehicle between the driver and frontpassenger seats, may alternatively or also be displayed via the HUD3550. Navigating and interacting throughout various menus associatedwith various functions, systems, etc. of the vehicle may be facilitatedvia the user interacting with the one or more touch sensors 3510 thatare associated with the steering wheel in conjunction with the HUD 3550.

In an example of operation and implementation, a driver of the vehicleperforms a particular motion and/or touches a particular location on thesteering wheel to bring up a main menu that is visible to the driver ofthe vehicle via the HUD 3550. Then, based on the main menu displayed,the driver of the vehicle performs a particular motion and/or touches aparticular location on the steering wheel to access a particular icon orportion of the main menu that is displayed via the HUD 3550, andperforms a particular motion and/or touches a particular location on thesteering wheel to select that particular icon or portion of the mainmenu that is displayed via the HUD 3550. In general, user interactivitywith the one or more functions, systems, etc. of the vehicle may befacilitated via the user interacting with the one or more touch sensors3510 that are associated with the steering wheel in conjunction with theHUD 3550.

FIG. 36 is a schematic block diagram of another embodiment 3600 of asteering wheel implemented with a touch sensor in accordance with thepresent invention. A touch sensor system includes one or more touchsensors 3610. In this diagram, the one or more touch sensors 3610 areimplemented within the steering wheel that is implemented within avehicle. Note that the one or more touch sensors 3610 may be implementedwithin one or more films that is/are located on the inside and/or theoutside of the steering wheel. The one or more touch sensors 3610 may beof any of a variety of one or more types including any one or more of atouchscreen, a button, an electrode, an external controller, rows ofelectrodes, columns of electrodes, a matrix of buttons, an array ofbuttons, a film that includes any desired implementation of componentsto facilitate touch sensor operation, and/or any other configuration bywhich interaction with the touch sensor may be performed. With respectto the various embodiments, implementations, etc. of various respectivetouch sensors as described herein, note that they may also be of anysuch variety of one or more types. In addition, note that the one ormore touch sensors 3610 may be implemented within nontransparent oropaque portions of the steering wheel.

At the bottom left of the diagram, one or more processing modules 3630is coupled to one or more drive-sense circuits (DSCs) 28. Note that theone or more processing modules 3630 may include integrated memory and/orbe coupled to other memory. At least some of the memory storesoperational instructions to be executed by the one or more processingmodules 3630. One or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 3610.

Based upon user interaction with the one or more touch sensors 3610associated with the steering wheel, the one or more processing modules3630 facilitate execution of control of different respective functionsassociated with the vehicle. Any number of different functions 1 throughn associated with the vehicle may be associated with user interactionwith the one or more touch sensors 3610. In this diagram, the one ormore processing modules 3630 facilitate execution of one or moreoperations associated with a heads up display (HUD) 3650, and audiosystem 3652 (e.g., which may include one or more speakers, a voicerecognition system, and/or any other audio related operations), and/orany other user interface 3659 that allows information to be provided tothe driver of the vehicle and/or allows input from the driver of thevehicle to be received.

Note that the coupling between the one or more processing modules 3630and the various respective functions associated with the vehicle alsomay be made using one or more DSCs 28. For example, the interaction andoperation between one or more processing modules 3630 and the variouscomponents associated with the vehicle to execute such functions may bemade via one or more DSCs 28.

In some examples, user interactivity with the steering wheel and the oneor more touch sensors 3610 associated therewith is driven in a mannersimilar to selectivity that is performed using the tab button on thekeyboard and the enter button on the keyboard. For example, on akeyboard, when navigating a menu with multiple icons, navigation throughthe respective icons currently displayed may be performed using the tabbutton on the keyboard and when the desired icon is highlighted orcurrently selected, pressing the enter button on the keyboard executesthe operation associated with that icon that is highlighted or currentlyselected. Within the operation of the one or more touch sensors 3610 andthe HUD 3650, a particular motion and/or touches a particular locationon the steering wheel (e.g., a tapping with the left index finger)performs the operation of navigation through the respective iconscurrently displayed via the HUD 3650, and a particular motion and/ortouches a particular location on the steering wheel (e.g., a tapping thesteering wheel with the right index finger) executes the operationassociated with that icon that is highlighted or currently selected.

Note also that any desired mapping of user interaction with the one ormore touch sensors 3610 associated with steering wheel may be made. Forexample, certain hand position on the steering wheel may be associatedwith a first operation, a particular pressure from the driver of thevehicle's hands on one or more portions of the steering wheel may beassociated with a second operation, a particular movement of the driverof the vehicle's hands on one or more portions of the steering wheel maybe associated with a third operation, a particular sequence of position,pressure, and/or movement of the driver of the vehicle's hands on one ormore portions of the steering wheel may be associated with a fourthoperation, etc. In general, any combination of various touches,positions, pressures, movements, sequences, tappings, rhythms, etc.and/or any other manner by which the driver of the vehicle may interactwith the one or more touch sensors 3610 that are associated withsteering wheel may be mapped and associated with various operationsassociated with the vehicle.

Note that interaction of the driver of the vehicle with the one or moretouch sensors 3610 may be performed without the driver of the vehicleever removing his or her hands from the steering wheel. The one or moreprocessing modules 3630 facilitate interaction with the driver of thevehicle via one or more of the HUD 3650, the audio system 3652, andand/or another user interface 3659 based on one or more menus, one ormore system information, and/or any other information.

FIG. 37 is a schematic block diagram of an embodiment 3700 of a field ofview user-interactive glass feature in accordance with the presentinvention. In this diagram one or more touch sensors are associated witha window. The one or more touch sensors may be implemented in any of avariety of ways including integrated into the window, included in thefilm on any layer of the window, using one or more integrated touchsensors, using one or more electrodes, etc.

Different respective portions of the window and the associated portionsof the one or more touch sensors that are associated with the windowcorrespond to control operations associated with elements visible viathe field of view of the window. For example, consider that the field ofview of the window includes a building, and outdoor light, vehicle, agate, the sprinkler system component, inground walkway lighting, etc.The respective portions of the one or more touch sensors that areassociated with the window provide the control based on the associatedwith the portions of the window that include the respective elements viathe field of view of the window.

For example, consider that the building is visible via the field of viewof the window in a left-hand portion of the window and the ingroundwalkway lighting is visible in the edit field of view of the windowcentrally below that left-hand portion of the window. Those portions ofthe one or more touch sensors that are located in the left-hand portionof the window provide touch control for the building (e.g., for any oneor more of the respective components therein).

In an example of operation and implementation, the user interacts withthe one or more touch sensors implemented in a left-hand portion of thefield of view of the window to facilitate control of one or more aspectsof the building and/or the inground walkway lighting. For example, auser interacting with the one or more touch sensors of the window thatare included in the field of view of the window that includes theinground walkway lighting controls of the inground walkway lighting(e.g., turning them on, turning them off, controlling their brightness,etc. and/or any other control operation related to the gate ingroundwalkway lighting).

In another example of operation and implementation, a user interactswith the one or more touch sensors implemented in an upper right-handportion of the field of view of the window to facilitate control of thegate. For example, a user interacting with the one or more touch sensorsof the window that are included in the field of view of the window thatincludes the gate controls of the gate (e.g., opening the gate, closingthe gate, locking the gate, enabling the gate, disabling the gate, etc.and/or any other control operation related to the gate).

Similarly, with respect to the other portions of the field of view ofthe window, a user interacting with the one or more touch sensorsimplemented in the respective portions of the field of view of thewindow allow the user to interact with those other components.

FIG. 38 is a schematic block diagram of another embodiment 3800 of afield of view user-interactive glass feature in accordance with thepresent invention. A touch sensor system includes one or more touchsensors 3810. Note that the one or more touch sensors 3810 may beimplemented and integrated within any type of element including glass,mirror, etc. Note that the one or more touch sensors 3810 may beimplemented within one or more films that is/are located on the insideand/or the outside of such an element including glass, mirror, etc. Theone or more touch sensors 3810 may be of any of a variety of one or moretypes including any one or more of a touchscreen, a button, anelectrode, an external controller, rows of electrodes, columns ofelectrodes, a matrix of buttons, an array of buttons, a film thatincludes any desired implementation of components to facilitate touchsensor operation, and/or any other configuration by which interactionwith the touch sensor may be performed. With respect to the variousembodiments, implementations, etc. of various respective touch sensorsas described herein, note that they may also be of any such variety ofone or more types.

At the bottom left of the diagram, one or more processing modules 3830is coupled to one or more drive-sense circuits (DSCs) 28. Note that theone or more processing modules 3830 may include integrated memory and/orbe coupled to other memory. At least some of the memory storesoperational instructions to be executed by the one or more processingmodules 3830. One or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 3810.

In an example of operation and implementation, the one or more touchsensors 3810 are associated with elements that are visible via differentrespective section and/or sub-section views of the field of view of thewindow. For example, control for one or more elements that are visiblevia 4 different respective section of the field of view of the windoware associated with 4 different portions of the one or more touchsensors 3810 on the middle and right hand side portion of the diagram.

In general, if any desired number of regions associated with differentrespective section views and/or sub-section views of the field of viewof the window that may be associated with the one or more touch sensors3810. In addition, any desired number of section views and sub-sectionviews may be included with the field of view of the window. For example,considering a section 3 view that includes one or more elements thereinbased on the field of view of the window. Note that there may be anynumber of sub-sections included therein. In one specific example, thesection 3 view includes one or more sub-section 3,1 through 3,4 views,etc. In general, any desired level of granularity, sub-division, etc. ofthe one or more section views, the one or more section views, may beimplemented with respect to the field of view of the window that isassociated with the one or more touch sensors 3810.

Based upon user interaction with the one or more touch sensors 3810 andspecifically on the one or more section views and/or sub-section viewsthat are associated with the one or more touch sensors 3810, the one ormore processing modules 3830 facilitate execution of control ofdifferent respective operations. For example, interaction with the oneor more section 1 view in the upper left-hand portion of the element onwhich the one or more identifiers are implemented execution of controlof operations associated with one or more elements included within thesection 1 view in the upper left-hand portion of the field of view ofthe window.

Note that the coupling between the one or more processing modules 3830and the various respective functions associated with the one or moresection views and/or sub-section views also may be made using one ormore DSCs 28. For example, the interaction and operation between one ormore processing modules 3830 and the various components associated withthe one or more section views and/or sub-section views to execute suchfunctions may be made via one or more DSCs 28.

FIG. 39 is a schematic block diagram of another embodiment 3900 of afield of view user-interactive glass feature in accordance with thepresent invention. In addition, in certain embodiments, identificationof the location of a user and/or identification of the user who isinteracting with the one or more touch sensors that are associated withthe field of view of the window is used to perform dynamic modificationof the sections and/or sub-sections within the field of view of thewindow. For example, one or more in floor sensors, transducers,actuators, etc. may be implemented to detect a user proximate to thewindow, interacting with the one or more touch sensors of the window,and/or who is likely to interact with the one or more touch sensors ofthe window. Based upon detection of the user, the respective one or moresections and/or sub-sections within the field of view of the window aredynamically modified based upon the expected field of view through thewindow based upon the location of the user.

In some examples, a signal is driven via capacitively coupling (CC)through the user to provide for unique identification of the user wheninteracting with the one or more touch sensors associated with thewindow. For example, when two respective users are interacting with theone or more touch sensors associated with the window, the two respectiveusers may have different perspectives of the respective elements withinthe field of view of the window. The respective sections and/orsub-sections within the field of view of the window are dynamicallyadjusted appropriately for each of the two respective users wheninteracting with the one or more touch sensors associated with thewindow. For example, for a user on the left-hand side of the window, thesections and/or sub-sections within the field of view of the window aredynamically adjusted with reference to the one or more touch sensorsassociated with the window so that control and interactivity of theelements within the field of view from that user's perspective areappropriately aligned. Similarly, for user on the right-hand side of thewindow, the sections and/or sub-sections within the field of view of thewindow are dynamically adjusted with reference to the one or more touchsensors associated with the window so that control and interactivity ofthe elements within the field of view from that user's perspective areappropriately aligned. In this way, a particular portion of the one ormore touch sensors can potentially provide control for differentrespective elements within the field of view of the window dependingupon which user is interacting with the one or more touch sensors.

In an example of operation and implementation, with a reference back toFIG. 37, consider an example that a first user is located on theleft-hand side of the window, and a second user is located on theright-hand side of the window. The first user views the building via aleft-hand central portion of the window. The second user views that samebuilding via a middle to right-hand portion of the window. One or moreprocessing modules is implemented to detect not only be user interactionof the first user and the second user but also to discriminate whichuser interaction corresponds to the first user for the second user. Assuch, different respective portions of the one or more touch sensorsassociated with the window provide control for the same element withinthe field of view of the window, e.g., the building, based upon whichuser is interacting with the one or more touch sensors associated withthe window based upon where that element within the field of view of thewindow, e.g., the building, is seen from the perspective of the twodifferent users.

FIG. 40 is a schematic block diagram of another embodiment 4000 of afield of view user-interactive glass feature in accordance with thepresent invention. This diagram shows different respective windows,which have different respective one or more touch sensors associatedtherewith, within a building providing different respective fields ofview. Note that some of the fields of view may have some overlap.

The different respective one or more touch sensors associated with thedifferent respective windows of the building provide for userinteraction with respect to those elements that are visible within therespective fields of view provided from the windows.

When there is overlap between two fields of view from two differentwindows, note that user interaction with the one or more touch sensorsassociated with those two different windows may provide for control ofthe same element visible from those two fields of view from those twodifferent windows.

Considering a specific example, consider that a sprinkler system isvisible via the field of view 4 from window 4 and also via the field ofview 5 from window 5. User interaction with the appropriate portion ofthe one or more touch sensors that are associated with window 4 and alsouser interaction with the appropriate portion of the one or more touchsensors that are associated with window 5 will control the sprinklersystem (e.g., turning it on, turning it off, controlling water only andflow, controlling the rate of operation of the components therein, anytiming controls, etc. and/or any other control operations associatedwith this breaker system).

FIG. 41 is a schematic block diagram of an embodiment of anotherembodiment of a method 4100 for execution by one or more devices inaccordance with the present invention. The method 4100 operates in step4110 by detecting motion or touch on one or more touch sensors. Asdescribed herein, note that the one or more touch sensors may beimplemented in any of a number of varieties including those describedherein.

The method 4100 operates in step 4120 by processing the motion or touch.Based on a failure to perform identification of the motion or touch, themethod 4100 operates via step 4130 and step 4135 by performing one ormore operations associated with failure to identify the motion or touch.Some examples of such operations associated with failure to identify themotion or touch may include one or more of taking no action, notifying auser, reporting an error, etc., and/or any other appropriate operation.

Based upon identification of the motion or touch, the method 4100operates by appropriately identifying the motion or touch in accordancewith one or more categories of motion or touch.

Based upon identification of the motion or touch being associated with afirst category of motion or touch, the method 4100 operates via step4140 and step 4145 by facilitating execution of a first one or moreactions.

Based upon failure to perform identification of the motion or touchbeing associated with a first category of motion or touch, the method4100 operates via step 4140 to step 4150 by appropriately identifyingthe motion or touch in accordance with other of the one or morecategories of motion or touch.

Based upon identification of the motion or touch being associated with asecond category of motion or touch, the method 4100 operates via step4150 and step 4155 by facilitating execution of a second one or moreactions.

In general, this process of performing identification of the motion ortouch being associated with different respective categories of motion ortouch can be performed based on n number of categories of motion ortouch.

For example, based upon failure to perform identification of the motionor touch being associated with first through n−1 categories of motion ortouch, the method 4100 operates via step 4160 by appropriatelyidentifying the motion or touch in accordance with the nth category ofmotion or touch.

Based upon identification of the motion or touch being associated withan nth category of motion or touch, the method 4100 operates via step4160 and step 4165 by facilitating execution of an nth one or moreactions. In the event that the identified motion or touch is notproperly associate with any of the respective categories of motion ortouch, the method 4100 ends, provides an error message, providesnotification to the user, provide notification to one or more otherdevices, etc.

FIG. 42 is a schematic block diagram of an embodiment 4200 of atouchscreen implemented with an external controller in accordance withthe present invention. In this diagram, one or more touch sensors 4210and an external controller that includes one or more buttons are bothcontrolled by one or more processing modules 4230. Note that the one ormore touch sensors 4210 may be of any variety and type as describedherein. In some examples, the one or more touch sensors 4210 areincluded within pad device, laptop, cell phone, smartphone, whiteboard,and interactive display, and navigation system display, and in vehicledisplay, etc., and/or any other type of device in which the one or moretouch sensors 4210 may be implemented. Note that the manner, type, andvariety of the respective one or more touch sensors may be of anydesired type.

A touch sensor system includes one or more touch sensors 4210. The oneor more touch sensors 4210 may be of any of a variety of one or moretypes including any one or more of a touchscreen, a button, anelectrode, an external controller, rows of electrodes, columns ofelectrodes, a matrix of buttons, an array of buttons, a film thatincludes any desired implementation of components to facilitate touchsensor operation, and/or any other configuration by which interactionwith the touch sensor may be performed. With respect to the variousembodiments, implementations, etc. of various respective touch sensorsas described herein, note that they may also be of any such variety ofone or more types.

At the bottom of the diagram, one or more processing modules 4230 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 4230 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 4230.A first group of one or more DSCs 28 is/are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more touch sensors 4210. A first group of one or more DSCs 28is/are implemented to drive and simultaneously to sense respective oneor more signals provided to the external controller (e.g., to the one ormore respective buttons implemented therein). In some examples, arespective DSC is implemented to drive and simultaneously to sense arespective one or more signals provided to a respective button on theexternal controller. For example, a first DSC is implemented to driveand simultaneously to sense a first respective one or more signalsprovided to a first respective button on the external controller, and asecond DSC is implemented to drive and simultaneously to sense a secondrespective one or more signals provided to a second respective button onthe external controller.

Note that the very same one or more processing modules 4230 isconfigured to drive and simultaneously to sense respective one or moresignals provided to both the one or more touch sensors 4210 and theexternal controller via the respective DSCs.

Note that control of the touchscreen may be effectuated based on userinteraction with one or more of the buttons. Such one or more buttonsassociated with the external controller may be alternative to, inaddition to, and/or cooperative in the control effectuated via the oneor more touch sensors 4210.

FIG. 43 is a schematic block diagram of various embodiment 4300 oftouchscreens implemented with external controllers in accordance withthe present invention. This diagram shows multiple different examples bywhich an external controller may be implemented in conjunction with oneor more touch sensors 4310.

Embodiment 4312 includes one or more touch sensors 4310 accompanied withan external controller that is implemented on a side of a touchscreen(e.g., on the left or right hand side of the touchscreen). Note that thevery same one or more processing modules is configured to drive andsimultaneously to sense respective one or more signals provided to boththe one or more touch sensors 4310 and the external controller via therespective DSCs.

Embodiment 4320 includes one or more touch sensors 4310 accompanied withtwo external controllers that are implemented on the sides of atouchscreen. Note that the very same one or more processing modules isconfigured to drive and simultaneously to sense respective one or moresignals provided to both the one or more touch sensors 4310 and also toboth of the external controllers via the respective DSCs.

Embodiment 4330 includes one or more touch sensors 4310 accompanied withan external controller that is implemented on a top of a touchscreen.Note that the very same one or more processing modules is configured todrive and simultaneously to sense respective one or more signalsprovided to both the one or more touch sensors 4310 and the externalcontroller via the respective DSCs.

Embodiment 4340 includes one or more touch sensors 4310 accompanied withone or more external controllers that is/are implemented on a back of atouchscreen. Note that the very same one or more processing modules isconfigured to drive and simultaneously to sense respective one or moresignals provided to both the one or more touch sensors 4310 and the oneor more external controllers via the respective DSCs.

Embodiment 4350 includes one or more touch sensors 4310 accompanied withone or more external controllers that is/are tethered to the one or moretouch sensors 4310. Note that the very same one or more processingmodules is configured to drive and simultaneously to sense respectiveone or more signals provided to both the one or more touch sensors 4310and the one or more external controllers that is/are tethered via therespective DSCs. Note that the DSCs that are implemented to drive andsimultaneously to sense respective one or more signals provided to theone or more external controllers that is/are tethered may be implementedwithin the one or more external controllers that is/are tethered and/orthe element that includes the one or more touch sensors 4310.

Embodiment 4360 includes one or more touch sensors 4310 accompanied withone or more external controllers that is/are in wireless communicationwith the one or more touch sensors 4310. Note that the one or moreprocessing modules is configured to drive and simultaneously to senserespective one or more signals provided to the one or more touch sensors4310. In some examples, the one or more external controllers that is/arein wireless communication with the one or more touch sensors 4310includes one or more respective DSCs.

Note that the DSCs that are implemented to drive and simultaneously tosense respective one or more signals provided to the one or moreexternal controllers that is/are tethered may be implemented within theone or more external controllers that is/are tethered and/or the elementthat includes the one or more touch sensors 4310.

In general, note that any desired configuration of one or more touchsensors and one or more external controllers including one or morebuttons may be implemented and coupled to one or more processing modulesvia a respective DSCs.

FIG. 44 is a schematic block diagram of an embodiment 4400 of atouchscreen implemented with one or more touch sensors implemented intouchscreen's bezel the in accordance with the present invention. Thisdiagram shows one or more touch sensors 4410 (e.g., such as in atouchscreen implementation that includes a bezel around at least aportion of the touchscreen). Different respective configurations arealso shown by one or more touch sensors may be implemented within thebezel. Note that the one or more touch sensors within the bezel may beimplemented using opaque or non-opaque materials. For example, the oneor more sensors implemented within the bezel need not be implementedusing transparent conductive materials.

The bottom of this diagram shows some different respective options(e.g., cross-sections thereof) by which the one or more touch sensorsimplemented within the bezel may be implemented. For example, the one ormore touch sensors implement within the bezel may include an array ofbuttons driven/sensed by one or more DSCs, a matrix of buttonsdriven/sensed by one or more DSCs, rows (or columns) of one or moreelectrodes driven/sensed by one or more DSCs, a matrix of electrodesdriven/sensed by one or more DSCs, etc. Note that these differentrespective options did not compose an exhaustive list. In addition, notethe different respective portions of the one or more touch sensorswithin the bezel may be implemented differently. For example, firstportion of the one or more touch sensors within the bezel may beimplemented using an array of buttons driven/sensed by one or more DSCswhile a second portion of the one or more touch sensors within the bezelmay be implemented using rows (or columns) of one or more electrodesdriven/sensed by one or more DSCs. In general, any desired combinationof different respective implementations of the one or more touch sensorsmay be included within the bezel.

FIG. 45 is a schematic block diagram of an embodiment of anotherembodiment of a method 4500 for execution by one or more devices inaccordance with the present invention. The method 4500 operates in step4510 by transmitting signals to sensors. For example, the sensors may beimplemented in any desired format and type including any of therespective examples, embodiments, etc. as described herein.

The method 4500 operates in step 4520 by detecting signals from thesensors. For example, such detection may include detecting the change ofany one or more of the signals that are being transmitted to thesensors. In addition, such detection may include detecting any one ormore additional signals that are coupled into the sensors. Note that theoperations of the steps 4510 and 4520 may be performed simultaneously.For example, note that the transmitting of the signals to the sensorsand detecting of the signals from the sensors may be performedsimultaneously. Note that one or more DSCs may be implemented to driveand simultaneously to sense one or more signals provided to the one ormore sensors.

The method 4500 operates in step 4530 by processing the signals from thesensors to generate digital information corresponding to userinteraction with one or more of the sensors.

Also, note that the different respective sensors may correspond todifferent respective portions of the system. For example, a first sensormay be associated with one or more touch sensors. A second sensor may beassociated with a button of an external controller.

FIG. 46 is a schematic block diagram of an embodiment of anotherembodiment of a method 4600 for execution by one or more devices inaccordance with the present invention. The method 4600 operates in step4610 by transmitting a first signal to a first sensor of a touchscreen.In addition, the method 4600 operates in step 4620 by detecting changeof the first signal to the first sensor of the touchscreen. Note thatthe operations of the steps 4610 and 4620 may be performedsimultaneously. Such operations may be performed using one or more DSCsimplemented to drive and simultaneously to sense one or more signalsprovided to the one or more sensors. The method 4600 operates in step4630 by processing the change of the first signal to generate digitalinformation corresponding to user interaction with the first sensor ofthe touchscreen.

Optionally, any number of additional sensors of the touchscreen may beimplemented and similarly operated. For example, the method 4600operates in step 4612 by transmitting an nth signal to an nth sensor ofa touchscreen. In addition, the method 4600 operates in step 4622 bydetecting change of the nth signal to the nth sensor of the touchscreen.Note that the operations of the steps 4610 and 4622 may be performedsimultaneously. Such operations may be performed using one or more DSCsimplemented to drive and simultaneously to sense one or more signalsprovided to the one or more sensors. The method 4600 operates in step4632 by processing the change of the nth signal to generate digitalinformation corresponding to user interaction with the nth sensor of thetouchscreen.

The method 4600 also operates in step 4614 by transmitting an n+1thsignal to a first sensor of an external controller. In addition, themethod 4600 operates in step 4623 by detecting change of the n+1thsignal to the first sensor of the external controller. Note that theoperations of the steps 4614 and 4624 may be performed simultaneously.Such operations may be performed using one or more DSCs implemented todrive and simultaneously to sense one or more signals provided to theone or more sensors. The method 4600 operates in step 4634 by processingthe change of the n+1th signal to generate digital informationcorresponding to user interaction with the first sensor of the externalcontroller.

Optionally, any number of additional sensors of the external controllermay be implemented and similarly operated. For example, the method 4600operates in step 4616 by transmitting an xth signal to an xth sensor ofan external controller. In addition, the method 4600 operates in step4626 by detecting change of the xth signal to the xth sensor of theexternal controller. Note that the operations of the steps 4610 and 4626may be performed simultaneously. Such operations may be performed usingone or more DSCs implemented to drive and simultaneously to sense one ormore signals provided to the one or more sensors. The method 4600operates in step 4636 by processing the change of the xth signal togenerate digital information corresponding to user interaction with thexth sensor of the external controller.

FIG. 47 is a schematic block diagram of an embodiment 4700 of a radialtire in accordance with the present invention. A vehicle typicallyincludes four tires that are in contact with the road or ground duringthe vehicle's operation. Certain types of vehicles include more thanfour tires (e.g., some trucks include two front tires and four reartires, two on each side, some commercial vehicles include larger numbersof tires sometimes up to 18 tires that are in contact with the roadaround during the vehicle's operation, etc.).

A radial tire is a particular type of vehicle entire that includes cordplies that are arranged in one or more directions with respect to thetread of the tire. The right-hand side of the diagram includes across-section of radial tire. Generally speaking, within a radial tire,a series of plies of cord reinforces the tire. The network or cords isimplemented to give shape and strength to the tire, and that section isoftentimes referred to as the carcass layers. Considering the radialtire from the portion that is in contact with the road, the radial tireincludes tread, below which is a belt composed of one or more layersand/oral minors, a shoulder strip on the outside of the tire, asidewall, and a wheel/rim strip. Typically, a bead wire is includedwithin the radial tire near where the tire interfaces with the wheel. Inaddition, a bead chafer and bead filler may be included above and/oraround the bead wire nearby the wheel/rim strip of the tire.

Referring to a cross-section of the belt of the tire, an x-ply (where xis some positive integer) includes steel belts transverse and/orlengthwise to the tread. In some examples, the belt is composed of thenylon fabric, a steel belt that is transverse to the tread, a steel beltthat is lengthwise to the tread, one or more carcass layers, and aninner liner.

During normal operation of the vehicle, as the tire is rotating,magnetic field is generated from the rotating tire. The one or moresteel belts within a radial tire generate a magnetic field as the tirerotates.

FIG. 48 is a schematic block diagram of an embodiment 4800 of a variousdegrees of inflation of a tire in accordance with the present invention.This diagram shows various examples of types of inflation with respectto tire. At the top of the diagram, a properly inflated tire willgenerally maintain uniform tread contact with the road or ground acrossthe entire tread of the tire.

In the middle of the diagram, an over-inflated tire will generally havetread contact with the road or ground only in the middle portion of thetread (e.g., center tread contact). At the bottom of diagram, anunder-inflated tire will generally have tread contact with the road orground on the outer portions of the tread (e.g., outer tread contact).

The shape of the tire will be modified based on the amount of errorpressure and/or degree of inflation of the tire. In addition, the shapeof the one or more steel belts within a radial tire will accordingly bemodified based on amount of air pressure and/or degree of inflation ofthe tire.

As a tire is rotating and as a magnetic field is being generated by therotating one or more steel belts of the tire, when there is a change ofamount of air pressure and/or degree of inflation of the tire (e.g.,based on a puncture, a rupture, flat, loss of air pressure, etc.), thenone or more characteristics of the magnetic field will also be changedbased on the shape of the tire being changed and the physicaldisplacement of the one or more steel treads and/or bead wire of thetire.

For example, when the tire has gone flat during the vehicle's motionoperation, the one or more steel treads and/or bead wire of the tirewill not have a substantially uniform distribution around the center ofthe wheel. For example, on the bottom of the wheel near the road orground, the one or more steel treads and/or bead wire of the tire willbe in a substantially straight line and relatively closer to the centerof the wheel. However, on the side and on the top of the tire, the oneor more steel treads and/or bead wire of the tire may still exhibit asubstantially uniform distribution around the center of the wheel. Thistransition from an inflated tire to a flat tire will result in amodification and change of the magnetic field being generated by therotating tire. Detection of this modification and change of the magneticfield may be used to determine an adverse condition with respect to thetire.

A tire pressure monitoring system is implemented using one or more DSCsas described herein in conjunction with one or more devices operative todetect and/or a monitor magnetic fields. Appropriate monitoring of themagnetic field that is generated by radio tire allows for monitoring ofthe tire and correlating that magnetic field to potential problems withthe tire (e.g., puncture, rupture, flat, loss of air pressure, etc.).

FIG. 49 is a schematic block diagram of an embodiment 4900 of a tiremonitoring system in accordance with the present invention. At the topof the diagram, one or more processing modules 4930 is coupled todrive-sense circuits (DSCs) 28. Note that the one or more processingmodules 4930 may include integrated memory and/or be coupled to othermemory. At least some of the memory stores operational instructions tobe executed by the one or more processing modules 4930.

In some examples, a respective DSC 28 is implemented to drive andsimultaneously to sense a respective one or more signals provided to arespective electromagnetic/inductive coupler 4925 that is proximate to aradial tire 4910 that includes one or more steel belts. For example, afirst DSC 28 is implemented to drive and simultaneously to sense a firstrespective one or more signals provided to a firstelectromagnetic/inductive coupler 4925 that is proximate to a radialtire 4910, and a second DSC 28 is implemented to drive andsimultaneously to sense a second respective one or more signals providedto a second electromagnetic/inductive coupler 4925 that is proximate toa radial tire 4910. Generally speaking note that the one or moreelectromagnetic/inductive couplers 4925 are implemented in a vehiclechassis domain and the tire 4910 is implemented in the tire domain. Themagnetic field that is generated by the one or more steel belts of thetire and/or the bead wire of the tire is coupled from the tire domain tothe vehicle chassis domain and particularly into the one or moreelectromagnetic/inductive couplers 4925.

Note that the magnetic field is generated from the rotating tire. Theone or more steel treads and/or the bead wire generate one or moremagnetic fields in the proximity of the rotating tire. In one example,an appropriately implemented and placed electromagnetic/inductivecoupler 4925, which is driven and simultaneously sensed by DSC 28,allows for monitoring of the one or more magnetic fields generated bythe rotating tire. In another example, appropriately implemented andplaced electromagnetic/inductive couplers 4925, which are driven andsimultaneously sensed by DSCs 28, allow for monitoring of the one ormore magnetic fields generated by the rotating tire.

Regardless of the particular implementation (e.g., a singleelectromagnetic/inductive coupler 4925 driven and simultaneously sensedby a single DSC 28, or multiple electromagnetic/inductive coupler 4925driven and simultaneously sensed by multiple DSCs 28), the one or moreprocessing modules 4930 is configured to process the signals that aresensed via the one or more DSCs 28 to generate a digital signal that isrepresentative of an electrical characteristic of the one or moreelectromagnetic/inductive couplers 4925, which is representative of themagnetic field that is generated by the rotating tire.

At the bottom left of the diagram, consider that a sinusoid signal istransmitted to a DSC 28 that is coupled to an electromagnetic/inductivecoupler 4925, then when the tire is operating in a steady state mode ofoperation (e.g., a relatively constant degree of inflation and/or airpressure corresponding to normal tire status), detection of thatsinusoidal signal via the DSC 28 is made.

At the bottom right of the diagram, then when the tire is operating in anon-steady state mode of operation (e.g., abnormal tire status that maybe associated to one or more of puncture, rupture, flat, loss of airpressure, etc.), detection of change of that sinusoidal signal via theDSC 28 is made. For example, based upon some type of abnormal tirestatus, the shape of the tire will change and the magnetic fieldgenerated by the rotating one or more steel belts and/or bead wire ofthe tire will effectuate change of one or more of the electricalcharacteristics of the electromagnetic/inductive coupler 4925. Note thatthe change of that sinusoidal signal via the DSC 28 may be manifested inany of a number of ways including a change of PC component, oscillatingmagnitude, phase, frequency, and/or any other parameter associated withsignal that is driven the DSC 28 and simultaneously sensed there from.

FIG. 50 is a schematic block diagram of another embodiment 5000 of atire monitoring system in accordance with the present invention. Thisdiagram shows the tire rotating and the magnetic fields generatedtherefrom. An axle, braking mechanism, etc. couples the wheel to thevehicle chassis. The tire is mounted to the wheel.

As the tire rotates, a magnetic field is generated by the rotating oneor more steel belts and/or bead wire of the tire. This magnetic fieldwill effectuate change of one or more of the electrical characteristicsof the electromagnetic/inductive coupler 4925. One or moreelectromagnetic/inductive couplers 5020 is arranged in any desiredconfiguration to facilitate monitoring of the magnetic field that isgenerated by the rotating tire. For example, electromagnetic/inductivecouplers 5020 may be arranged in a straight line (e.g., one dimensionalspace, 1-D) on the vehicle chassis to monitor the magnetic field isgenerated by the rotating tire. Alternatively, electromagnetic/inductivecouplers 5020 may be arranged in a planar array (e.g., two dimensionalspace, 2-D) on the vehicle chassis to monitor the magnetic field isgenerated by the rotating tire. In even another embodiment,electromagnetic/inductive couplers 5020 may be arranged in anythree-dimensional configuration (e.g., three dimensional space, 3-D) onthe vehicle chassis to monitor the magnetic field is generated by therotating tire.

FIG. 51 is a schematic block diagram of an embodiment 5100 of tireprofile monitoring in accordance with the present invention. Asmentioned above, one or more electromagnetic/inductive couplers may bearranged in any desired configuration (e.g., 1-D space, 2-D space, 3-Dspace) on the vehicle chassis to monitor the magnetic field is generatedby the rotating tire.

In a multiple electromagnetic/inductive coupler implementation, a tireprofile that is associated with the magnetic field generated by therotating tire may be generated at different respective times. Forexample, a tire profile 1 is generated at the time 1, a tire profile 2is generated at the time 2, etc.

One or more processing modules is configured to process signals coupledfrom one or more DSCs that are based on one or moreelectromagnetic/inductive couplers to generate one or more tire profilesassociated with the magnetic field is generated by the rotating tire.For example, consider an implementation that includes 4electromagnetic/inductive couplers. A tire profile 1 is generated at thetime 1 that is based on measurements associated with those 4electromagnetic/inductive couplers. Similarly, a tire profile 2 isgenerated at the time 2 that is based on measurements associated withthose 4 electromagnetic/inductive couplers. Generally speaking, thisprocess may be performed any number of times up to n, where n is apositive integer.

As the shape of the tire changes, the magnetic field being generated bythe rotating tire will also change. Detection of changes of the tireprofile at different times (e.g., a delta or the difference a betweenthe tire profile 1 at time 1 and the tire profile 2 at time 2, and/or adelta or the difference b between the tire profile 2 at time 2 and thetire profile n at time n) allows for identification of an adversecondition with respect to the tire (e.g., puncture, rupture, flat, lossof air pressure, etc.).

In addition, note that a single electromagnetic/inductive coupler 5020may alternatively be implemented on the vehicle chassis to monitor themagnetic field is generated by the rotating tire. Instead of generatinga higher profile that includes multiple measurements associated withmultiple electromagnetic/inductive couplers, a single measurementassociated with a single electromagnetic/inductive coupler is used.Similarly, detection of changes of that measurement at different timesmay be used for identification of an adverse condition with respect tothe tire (e.g., puncture, rupture, flat, loss of air pressure, etc.).

FIG. 52 is a schematic block diagram of another embodiment 5200 of atire monitoring system in accordance with the present invention. In thisdiagram, one or more sensors 5240 is associated with the tire. Forexample, the one or more sensors 5240 may be implemented within one ormore liners associated with the tire.

At the top of the diagram are examples of liners that include one ormore sensors within a tire. Note that a liner may be implemented withinthe inner lining of a tire, integrated into the tire built, installedduring tire mounting, etc. and/or otherwise associated with and/orimplemented with the tire. Note that any desired implementation ofsensors may be implemented within the one or more liners associated withthe tire. For example, different liners may be implemented based ondifferent patterns inside of the tire such as based on a mesh, matrix ofsensors, one or more electrodes in a first direction (e.g., around tire,start/end), one or more electrodes in two directions. For example,considering some possible cross-sections of sensors include an array ofsensors driven/sensed by one or more DSCs, a matrix of sensorsdriven/sensed by one or more DSCs, one or more rows (or columns) ofelectrodes/sensors driven/sensed by one or more DSCs, a matrix ofelectrodes sensors driven/sensed by one or more DSCs, etc.

One or more processing modules 5240 is coupled to drive-sense circuits(DSCs) 28. Note that the one or more processing modules 5240 may includeintegrated memory and/or be coupled to other memory. At least some ofthe memory stores operational instructions to be executed by the one ormore processing modules 5240. A DSC 28 is implemented to drive andsimultaneously to sense one or more signals provided to one of the oneor more sensors 5230.

When there is a change of amount of air pressure and/or degree ofinflation of the tire (e.g., based on a puncture, a rupture, flat, lossof air pressure, etc.) and/or an actual physical modification of one ormore of the sensors implemented within the one or more liners associatedwith the tire (e.g., based on a puncture, a rupture, flat, etc.), theone or more DSCs 28 will detect, based on a change of electricalcharacteristic of one or more of the sensors, an adverse condition withrespect to the tire.

In addition, one or more energy harvesters 5210 is implemented withinthe tire and/or wheel. The tire includes one or more energy harvesters5210 to energize (e.g., drive/sense) the one or more sensors within thetire.

Examples of energy harvester including any one or more of the following:photovoltaic: generating electric power by converting photon irradiationsuch as solar iteration into electricity, piezoelectric effect: convertsmechanical strain into electric current or voltage, pyroelectric:pyroelectric effect converts a temperature change into electric currentor voltage (e.g., analogous to the piezoelectric effect, which isanother type of ferroelectric behavior), themoelectrics: a thermalgradient formed between two dissimilar conductors produces a voltage,electrostatic (capacitive): changing capacitance of vibration-dependentcapacitors (e.g., vibrations separate the plates of a charged variablecapacitor, and mechanical energy is converted into electrical energy),magnetic induction: magnets wobbling on a cantilever are sensitive toeven small vibrations and generate microcurrents by moving relative toconductors due to Faraday's law of induction (e.g., thekinetic/rotational energy of the rotating tire baby converted intoelectrical energy using magnetic induction). Note that these examples donot compose an exhaustive list and other forms of energy harvesting maybe implemented.

Within the tire, the one or more energy harvesters 5210 provideselectric energy that is stored in one or more energy storage elements5220. A non-exhaustive list of examples of the one or more energystorage elements 5220 include a capacitor, a battery, etc. The one ormore energy storage elements 5220 provides energy to the one or moreprocessing modules 5240, the one or more DSCs 28, and one or morecommunication modules 5250. The one or more communication modules 5250is configured to perform communication to and from one or more othercommunication modules associated with the vehicle chassis that are alsoin communication with one or more other processing modules implementedto process the signals provided from the tire to identify an adversecondition with respect to the tire. For example, such communication maybe performed wirelessly, via electromagnetic (EM) induction, near-fieldcommunication (NFC), etc., and/or other means.

FIG. 53 is a schematic block diagram of another embodiment 5300 of atire monitoring system in accordance with the present invention. Thisdiagram shows one possible implementation by which communication fromone or more devices within the tire is communicated to one or moredevices within the vehicle chassis.

One or more energy harvesters 5310 is implemented to generate energythat is stored in one or more energy storage elements 5320. One or moreprocessing modules 28, one or more communication modules 5350, and oneor more DSCs are powered and/or energized by the energy from the one ormore energy storage elements 5320. In addition, one or more sensors 5330are implemented within tire. As described herein, any number ofdifferent limitations may be used by which the one or more sensors 5330are implemented within the tire. For example, they may be implementedwithin one or more liners within the tire.

The one or more processing modules 5340 is coupled to drive-sensecircuits (DSCs) 28. Note that the one or more processing modules 5340may include integrated memory and/or be coupled to other memory. Atleast some of the memory stores operational instructions to be executedby the one or more processing modules 5340. A DSC 28 is implemented todrive and simultaneously to sense one or more signals provided to one ofthe one or more sensors 5330.

The one or more communication modules 5370 is configured to supportcommunications with one or more other communication modules 5360 thatare implemented within the vehicle chassis domain. In addition, one ormore other processing modules 5370 is coupled to the one or morecommunication modules 5370. Note that the one or more processing modules5370 may include integrated memory and/or be coupled to other memory. Atleast some of the memory stores operational instructions to be executedby the one or more processing modules 5370. The one or more processingmodules 5370 is configured to interact with and or communicate with anyone or more other system, device, module, circuitry, component, etc.within the vehicle.

Note also that the elements within this diagram may be viewed as beingimplemented in a vehicle chassis domain or a tire domain. For example,the one or more elements within the tire may be viewed as beingimplemented within the tire domain, and the one or more elements withinthe vehicle may be viewed as being within the vehicle chassis domain.Also, note that the communication between the one or more communicationmodules 5350 and 5360 may be performed in accordance with number ofdifferent means (e.g., wirelessly, via electromagnetic (EM) induction,near-field communication (NFC), etc., and/or other means).

FIG. 54 is a schematic block diagram of another embodiment 5400 of atire monitoring system in accordance with the present invention. Thisdiagram shows one possible implementation by which communication fromone or more devices within the tire is communicated to one or moredevices within the vehicle chassis.

One or more energy harvesters 5410 is implemented to generate energythat is stored in one or more energy storage elements 5420. One or moreprocessing modules 28, one or more communication modules 5450, and oneor more DSCs are powered and/or energized by the energy from the one ormore energy storage elements 5420. In addition, one or more sensors 5430are implemented within tire. As described herein, any number ofdifferent limitations may be used by which the one or more sensors 5430are implemented within the tire. For example, they may be implementedwithin one or more liners within the tire.

The one or more processing modules 5440 is coupled to drive-sensecircuits (DSCs) 28. Note that the one or more processing modules 5440may include integrated memory and/or be coupled to other memory. Atleast some of the memory stores operational instructions to be executedby the one or more processing modules 5440. A DSC 28 and a first one ormore DSCs 28 is implemented to drive and simultaneously to sense one ormore signals provided to one of the one or more sensors 5430. A DSC 28in a second one or more DSCs 28 is implemented to drive andsimultaneously to sense one or more signals provided to one of the oneor more electromagnetic/inductive couplers 5425 implemented within thetire domain.

Communication is performed between one or more electromagnetic/inductivecouplers 5425 implemented within the tire domain and another one or moreelectromagnetic/inductive couplers 5425 implemented within the tiredomain implemented within the vehicle chassis domain. In addition, oneor more other processing modules 5470 is coupled to the second one ormore DSCs 28 is implemented to drive and simultaneously to sense one ormore signals provided to one of the one or moreelectromagnetic/inductive couplers 5425 implemented within the vehiclechassis domain.

Note that the one or more processing modules 5470 may include integratedmemory and/or be coupled to other memory. At least some of the memorystores operational instructions to be executed by the one or moreprocessing modules 5470. The one or more processing modules 5470 isconfigured to interact with and or communicate with any one or moreother system, device, module, circuitry, component, etc. within thevehicle.

In addition, note that the signals communicated between the respectivefirst one or more DSCs 28 implemented within the tire domain and thesecond one or more DSCs 28 implemented within the vehicle chassis domainare not only based on information related to the one or more touchsensors 5430 that are associated with the tire, but they may alsoinclude information related to the magnetic field generated from arotating tire. For example, from the rotating one or more steel beltsand/or bead wire of the tire. Note that the second one or more DSCs 28implemented within the vehicle chassis domain are capable not only todetect signals via the one or more electromagnetic/inductive couplers5425 implemented within the tire and vehicle chassis domains, but arealso capable to detect any signal that is coupled into the one or moreelectromagnetic/inductive couplers 5425 implemented within the tire andvehicle chassis domains.

This diagram particularly shows communication between the tire domain inthe vehicle chassis domain being performed based on electromagnetic (EM)induction. Note also that the communication between the communicationbetween the tire domain in the vehicle chassis domain may alternativelybe performed in accordance with number of different means (e.g.,wirelessly, near-field communication (NFC), etc., and/or other means).

It is noted that terminologies as may be used herein such as bit stream,stream, signal sequence, etc. (or their equivalents) have been usedinterchangeably to describe digital information whose contentcorresponds to any of a number of desired types (e.g., data, video,speech, text, graphics, audio, etc. any of which may generally bereferred to as ‘data’).

As may be used herein, the terms “substantially” and “approximately”provide an industry-accepted tolerance for its corresponding term and/orrelativity between items. For some industries, an industry-acceptedtolerance is less than one percent and, for other industries, theindustry-accepted tolerance is 10 percent or more. Other examples ofindustry-accepted tolerance range from less than one percent to fiftypercent. Industry-accepted tolerances correspond to, but are not limitedto, component values, integrated circuit process variations, temperaturevariations, rise and fall times, thermal noise, dimensions, signalingerrors, dropped packets, temperatures, pressures, material compositions,and/or performance metrics. Within an industry, tolerance variances ofaccepted tolerances may be more or less than a percentage level (e.g.,dimension tolerance of less than +/−1%). Some relativity between itemsmay range from a difference of less than a percentage level to a fewpercent. Other relativity between items may range from a difference of afew percent to magnitude of differences.

As may also be used herein, the term(s) “configured to”, “operablycoupled to”, “coupled to”, and/or “coupling” includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for an example of indirectcoupling, the intervening item does not modify the information of asignal but may adjust its current level, voltage level, and/or powerlevel. As may further be used herein, inferred coupling (i.e., where oneelement is coupled to another element by inference) includes direct andindirect coupling between two items in the same manner as “coupled to”.

As may even further be used herein, the term “configured to”, “operableto”, “coupled to”, or “operably coupled to” indicates that an itemincludes one or more of power connections, input(s), output(s), etc., toperform, when activated, one or more its corresponding functions and mayfurther include inferred coupling to one or more other items. As maystill further be used herein, the term “associated with”, includesdirect and/or indirect coupling of separate items and/or one item beingembedded within another item.

As may be used herein, the term “compares favorably”, indicates that acomparison between two or more items, signals, etc., provides a desiredrelationship. For example, when the desired relationship is that signal1 has a greater magnitude than signal 2, a favorable comparison may beachieved when the magnitude of signal 1 is greater than that of signal 2or when the magnitude of signal 2 is less than that of signal 1. As maybe used herein, the term “compares unfavorably”, indicates that acomparison between two or more items, signals, etc., fails to providethe desired relationship.

As may be used herein, one or more claims may include, in a specificform of this generic form, the phrase “at least one of a, b, and c” orof this generic form “at least one of a, b, or c”, with more or lesselements than “a”, “b”, and “c”. In either phrasing, the phrases are tobe interpreted identically. In particular, “at least one of a, b, and c”is equivalent to “at least one of a, b, or c” and shall mean a, b,and/or c. As an example, it means: “a” only, “b” only, “c” only, “a” and“b”, “a” and “c”, “b” and “c”, and/or “a”, “b”, and “c”.

As may also be used herein, the terms “processing module”, “processingcircuit”, “processor”, “processing circuitry”, and/or “processing unit”may be a single processing device or a plurality of processing devices.Such a processing device may be a microprocessor, micro-controller,digital signal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on hard coding of thecircuitry and/or operational instructions. The processing module,module, processing circuit, processing circuitry, and/or processing unitmay be, or further include, memory and/or an integrated memory element,which may be a single memory device, a plurality of memory devices,and/or embedded circuitry of another processing module, module,processing circuit, processing circuitry, and/or processing unit. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, cache memory, and/or any device that stores digital information.Note that if the processing module, module, processing circuit,processing circuitry, and/or processing unit includes more than oneprocessing device, the processing devices may be centrally located(e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that if the processing module, module, processing circuit,processing circuitry and/or processing unit implements one or more ofits functions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory and/or memory element storing thecorresponding operational instructions may be embedded within, orexternal to, the circuitry comprising the state machine, analogcircuitry, digital circuitry, and/or logic circuitry. Still further notethat, the memory element may store, and the processing module, module,processing circuit, processing circuitry and/or processing unitexecutes, hard coded and/or operational instructions corresponding to atleast some of the steps and/or functions illustrated in one or more ofthe Figures. Such a memory device or memory element can be included inan article of manufacture.

One or more embodiments have been described above with the aid of methodsteps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claims. Further, the boundariesof these functional building blocks have been arbitrarily defined forconvenience of description. Alternate boundaries could be defined aslong as the certain significant functions are appropriately performed.Similarly, flow diagram blocks may also have been arbitrarily definedherein to illustrate certain significant functionality.

To the extent used, the flow diagram block boundaries and sequence couldhave been defined otherwise and still perform the certain significantfunctionality. Such alternate definitions of both functional buildingblocks and flow diagram blocks and sequences are thus within the scopeand spirit of the claims. One of average skill in the art will alsorecognize that the functional building blocks, and other illustrativeblocks, modules and components herein, can be implemented as illustratedor by discrete components, application specific integrated circuits,processors executing appropriate software and the like or anycombination thereof.

In addition, a flow diagram may include a “start” and/or “continue”indication. The “start” and “continue” indications reflect that thesteps presented can optionally be incorporated in or otherwise used inconjunction with one or more other routines. In addition, a flow diagrammay include an “end” and/or “continue” indication. The “end” and/or“continue” indications reflect that the steps presented can end asdescribed and shown or optionally be incorporated in or otherwise usedin conjunction with one or more other routines. In this context, “start”indicates the beginning of the first step presented and may be precededby other activities not specifically shown. Further, the “continue”indication reflects that the steps presented may be performed multipletimes and/or may be succeeded by other activities not specificallyshown. Further, while a flow diagram indicates a particular ordering ofsteps, other orderings are likewise possible provided that theprinciples of causality are maintained.

The one or more embodiments are used herein to illustrate one or moreaspects, one or more features, one or more concepts, and/or one or moreexamples. A physical embodiment of an apparatus, an article ofmanufacture, a machine, and/or of a process may include one or more ofthe aspects, features, concepts, examples, etc. described with referenceto one or more of the embodiments discussed herein. Further, from figureto figure, the embodiments may incorporate the same or similarly namedfunctions, steps, modules, etc. that may use the same or differentreference numbers and, as such, the functions, steps, modules, etc. maybe the same or similar functions, steps, modules, etc. or differentones.

Unless specifically stated to the contra, signals to, from, and/orbetween elements in a figure of any of the figures presented herein maybe analog or digital, continuous time or discrete time, and single-endedor differential. For instance, if a signal path is shown as asingle-ended path, it also represents a differential signal path.Similarly, if a signal path is shown as a differential path, it alsorepresents a single-ended signal path. While one or more particulararchitectures are described herein, other architectures can likewise beimplemented that use one or more data buses not expressly shown, directconnectivity between elements, and/or indirect coupling between otherelements as recognized by one of average skill in the art.

The term “module” is used in the description of one or more of theembodiments. A module implements one or more functions via a device suchas a processor or other processing device or other hardware that mayinclude or operate in association with a memory that stores operationalinstructions. A module may operate independently and/or in conjunctionwith software and/or firmware. As also used herein, a module may containone or more sub-modules, each of which may be one or more modules.

As may further be used herein, a computer readable memory includes oneor more memory elements. A memory element may be a separate memorydevice, multiple memory devices, or a set of memory locations within amemory device. Such a memory device may be a read-only memory, randomaccess memory, volatile memory, non-volatile memory, static memory,dynamic memory, flash memory, cache memory, and/or any device thatstores digital information. The memory device may be in a form asolid-state memory, a hard drive memory, cloud memory, thumb drive,server memory, computing device memory, and/or other physical medium forstoring digital information.

While particular combinations of various functions and features of theone or more embodiments have been expressly described herein, othercombinations of these features and functions are likewise possible. Thepresent disclosure is not limited by the particular examples disclosedherein and expressly incorporates these other combinations.

What is claimed is:
 1. A touch sensor device comprising: a first touchsensor system that includes: a first electrode; and a first drive-sensecircuit (DSC) operably coupled to the first electrode, wherein, whenenabled, the first DSC is configured to: drive a first signal via afirst single line coupling to the first electrode and simultaneouslysense, via the first single line, change of the first signal that isbased on an electrical characteristic of the first electrode; andprocess the first signal to generate a first digital signal that isrepresentative of the electrical characteristic of the first electrode;and a second touch sensor system that is configured to service across-section of the touch sensor devices that is also serviced by thefirst touch sensor system and that includes: a second electrode; and asecond DSC operably coupled to the second electrode, wherein, whenenabled, the second DSC is configured to: drive a second signal via asecond single line coupling to the second electrode and simultaneouslysense, via the second single line, change of the second signal that isbased on an electrical characteristic of the second electrode; andprocess the second signal to generate a second digital signal that isrepresentative of the electrical characteristic of the second electrode.2. The touch sensor device of claim 1 further comprising: memory thatstores operational instructions; and one or more processing modulesoperably coupled to the first DSC, the second DSC, and to the memory,wherein the one or more processing modules, when enabled, configured toexecute the operational instructions to: process the first digitalsignal that is representative of the electrical characteristic of thefirst electrode to determine the electrical characteristic of the firstelectrode; and process the second digital signal that is representativeof the electrical characteristic of the second electrode to determinethe electrical characteristic of the second electrode.
 3. The touchsensor device of claim 1, wherein: the change of the first signal thatis based on the electrical characteristic of the first electrode beingbased on user interaction with the first electrode; and the change ofthe second signal that is based on the electrical characteristic of thefirst electrode being based on user interaction with the secondelectrode; and further comprising: memory that stores operationalinstructions; and one or more processing modules operably coupled to thefirst DSC, the second DSC, and to the memory, wherein the one or moreprocessing modules, when enabled, configured to execute the operationalinstructions to: process the first digital signal that is representativeof the electrical characteristic of the first electrode to detect theuser interaction with the first electrode; and process the seconddigital signal that is representative of the electrical characteristicof the second electrode to detect the user interaction with the secondelectrode.
 4. The touch sensor device of claim 1, wherein operation ofthe second touch sensor system is used to verify operation of the firsttouch sensor system based on any deviation of the operation of thesecond touch sensor system compared to the operation of the first touchsensor system.
 5. The touch sensor device of claim 1, wherein the secondtouch sensor system configured to operate redundantly to the first touchsensor system.
 6. The touch sensor device of claim 1, wherein the secondtouch sensor system configured to operate cooperatively with the firsttouch sensor system including to operate within different modes ofoperation at different times.
 7. The touch sensor system of claim 1,wherein the first electrode and the second electrode are bothimplemented in a same direction.
 8. The touch sensor system of claim 1,wherein the first electrode is adjacently aligned to the secondelectrode.
 9. The touch sensor system of claim 1, wherein: the firsttouch sensor system that includes: a first plurality of electrodesincluding the first electrode that is implemented in a first direction;and a second plurality of electrodes that is implemented in a seconddirection that is different than the first direction; and the secondtouch sensor system that includes: a third plurality of electrodesincluding the second electrode that is implemented in the firstdirection; and a fourth plurality of electrodes that is implemented inthe second direction that is different than the first direction.
 10. Thetouch sensor system of claim 1, wherein the first DSC further comprises:a power source circuit operably coupled to the first electrode via thefirst single line, wherein, when enabled, the power source circuit isconfigured to provide the first signal that includes an analog signalvia the first single line coupling to the first electrode, and whereinthe analog signal includes at least one of a DC (direct current)component or an oscillating component; and a power source changedetection circuit operably coupled to the power source circuit, wherein,when enabled, the power source change detection circuit is configuredto: detect an effect on the analog signal that is based on theelectrical characteristic of the first electrode; and generate thedigital signal that is representative of the electrical characteristicof the first electrode.
 11. The touch sensor system of claim 10 furthercomprising: the power source circuit including a power source to sourceat least one of a voltage or a current to the touch sensor via the firstsingle line; and the power source change detection circuit including: apower source reference circuit configured to provide at least one of avoltage reference or a current reference; and a comparator configured tocompare the at least one of the voltage and the current provided to thefirst electrode via the first single line to the at least one of thevoltage reference and the current reference to produce the analogsignal.
 12. A touch sensor device comprising: a first touch sensorsystem that includes: a first plurality of electrodes; and a firstplurality of drive-sense circuits (DSCs) operably coupled to the firstplurality of electrodes such that each DSC of the first plurality ofDSCs is operably coupled to a respective one electrode of the firstplurality of electrodes, wherein: when enabled, a first DSC of the firstplurality of DSCs is configured to: drive a first signal via a firstsingle line coupling to a first electrode of the first plurality ofelectrodes and simultaneously sense, via the first single line, changeof the first signal that is based on an electrical characteristic of thefirst electrode of the first plurality of electrodes; and process thefirst signal to generate a first digital signal that is representativeof the electrical characteristic of the first electrode of the firstplurality of electrodes; and when enabled, a second DSC of the firstplurality of DSCs is configured to: drive a second signal via a secondsingle line coupling to a second electrode of the first plurality ofelectrodes and simultaneously sense, via the second single line, changeof the second signal that is based on an electrical characteristic ofthe second electrode of the first plurality of electrodes; and processthe second signal to generate a second digital signal that isrepresentative of the electrical characteristic of the second electrodeof the first plurality of electrodes; and a second touch sensor systemthat is configured to service a cross-section of the touch sensordevices that is also serviced by the first touch sensor system and thatincludes: a second plurality of electrodes; and a second plurality ofDSCs operably coupled to the second plurality of electrodes such thateach DSC of the second plurality of DSCs is operably coupled to arespective one electrode of the second plurality of electrodes, wherein:when enabled, a first DSC of the second plurality of DSCs is configuredto: drive a third signal via a third single line coupling to a firstelectrode of the second plurality of electrodes and simultaneouslysense, via the third single line, change of the third signal that isbased on an electrical characteristic of the first electrode of thesecond plurality of electrodes; and process the third signal to generatea third digital signal that is representative of the electricalcharacteristic of the first electrode of the second plurality ofelectrodes; when enabled, a second DSC of the second plurality of DSCsis configured to: drive a fourth signal via a fourth single linecoupling to a second electrode of the second plurality of electrodes andsimultaneously sense, via the fourth single line, change of the fourthsignal that is based on an electrical characteristic of the secondelectrode of the second plurality of electrodes; and process the fourthsignal to generate a fourth digital signal that is representative of theelectrical characteristic of the first electrode of the second pluralityof electrodes.
 13. The touch sensor device of claim 12 furthercomprising: memory that stores operational instructions; and one or moreprocessing modules operably coupled to the first DSC of the firstplurality of DSCs, the second DSC of the first plurality of DSCs, thefirst DSC of the second plurality of DSCs, the second DSC of the secondplurality of DSCs, and to the memory, wherein the one or more processingmodules, when enabled, configured to execute the operationalinstructions to: process the first digital signal that is representativeof the electrical characteristic of the first electrode of the firstplurality of electrodes to determine the electrical characteristic ofthe first electrode of the first plurality of electrodes; process thesecond digital signal that is representative of the electricalcharacteristic of the electrical characteristic of the second electrodeof the first plurality of electrodes to determine the electricalcharacteristic of the electrical characteristic of the second electrodeof the first plurality of electrodes; process the third digital signalthat is representative of the electrical characteristic of the firstelectrode of the second plurality of electrodes to determine theelectrical characteristic of the first electrode of the second pluralityof electrodes; and process the fourth digital signal that isrepresentative of the electrical characteristic of the second electrodeof the second plurality of electrodes to determine the electricalcharacteristic of the second electrode of the second plurality ofelectrodes.
 14. The touch sensor device of claim 12, wherein operationof the second touch sensor system is used to verify operation of thefirst touch sensor system based on any deviation of the operation of thesecond touch sensor system compared to the operation of the first touchsensor system.
 15. The touch sensor device of claim 12, wherein thesecond touch sensor system configured to operate redundantly to thefirst touch sensor system.
 16. The touch sensor device of claim 12,wherein the second touch sensor system configured to operatecooperatively with the first touch sensor system including to operatewithin different modes of operation at different times.
 17. The touchsensor system of claim 12, wherein: the first plurality of electrode areimplemented in a first direction; and the second plurality of electrodeare implemented in a second direction that is different than the firstdirection.
 18. The touch sensor system of claim 12, wherein the firstelectrode of the first plurality of electrodes is adjacently aligned tothe first electrode of the second plurality of electrodes.
 19. The touchsensor system of claim 12, wherein the first DSC further comprises: apower source circuit operably coupled to the first electrode of thefirst plurality of electrodes via the first single line, wherein, whenenabled, the power source circuit is configured to provide the firstsignal that includes an analog signal via the first single line couplingto the first electrode of the first plurality of electrodes, and whereinthe analog signal includes at least one of a DC (direct current)component or an oscillating component; and a power source changedetection circuit operably coupled to the power source circuit, wherein,when enabled, the power source change detection circuit is configuredto: detect an effect on the analog signal that is based on theelectrical characteristic of the first electrode of the first pluralityof electrodes; and generate the digital signal that is representative ofthe electrical characteristic of the first electrode of the firstplurality of electrodes.
 20. The touch sensor system of claim 19 furthercomprising: the power source circuit including a power source to sourceat least one of a voltage or a current to the touch sensor via the firstsingle line; and the power source change detection circuit including: apower source reference circuit configured to provide at least one of avoltage reference or a current reference; and a comparator configured tocompare the at least one of the voltage and the current provided to thefirst electrode of the first plurality of electrodes via the firstsingle line to the at least one of the voltage reference and the currentreference to produce the analog signal.